Agilex™ 9 R17B Direct RF System on Module

  • AgilexTM 9 SoC FPGA R17B Package – AGRW014 Device
  • 8GB DDR4 for HPS, 8GB DDR4 for FPGA
  • 32GB eMMC Flash and 256MB QSPI Flash
  • 16 x FGT transceivers up to 58Gbps PAM4
  • ADC x 4 & DAC x 4 with sampling rate up to 64Gsps
  • Up to 1,437,240 Logic elements

Documents

Document

Document

Design Support

Design Support

Design Support

  • Specification
  • Custom Design
FeaturesDetails
Agilex 9 R17B Direct RF Soc FPGA

Quad-core 64-bit ARM® Cortex®-A53 up to 1.4GHz
Up to 1,437,240 Logic elements
16 x FGT Transceivers up to 58Gbps PAM4
ADC x 4 & DAC x 4 ; Sampling rate up to 64Gsps

Memory

HPS 72bit DDR4 (8GB)
FPGA 72bit DDR4 (8GB)
HPS 8bit eMMC (32GB Upgradable)
SDM QSPI Flash (1Gb Upgradable)

On SOM Features

Gigabit Ethernet PHY x 1
USB2.0 OTG through On SOM PHY x 1
On Board Clock Generators
JTAG Header/AS x 1 (optional)
Boot Selection Switch x 1 (optional)

Board to Board Connector Interfaces

HPS/SDM Interfaces

    • RGMII Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
    • USB2.0 OTG X 1 Port (through On -SOM USB PHY)
    • I2C Interface x 1
    • Debug UART x1
    • JTAG Interface x 1

HPS to FPGA Interfaces

    • H2F SPI x 1
    • H2F I2C x 1

FPGA Interfaces

    • General Purpose Transceivers x 16 (up to 58Gbps – PAM4)
    • FPGA IO’s (48LVDS/96SE)

RF Connector Interfaces

    • ADC x 4
    • DAC x 4
General Features
  • Power Input: 12V through B2B Connector 2
  • Form Factor: 82mm x 110mm
  • Operating Temperature: -40°C to +85°C (Industrial)
  • Environment Specification: REACH & RoHS3 Compliant

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