VersalTM AI Edge System on Module
- VersalTMAI Edge with SFVA784 package
- Compatible with VE2302/2202/2102/2002/VM1102 devices
- Up to 328K Logic cells & 150K LUTs
- 4GB LPDDR4 Memory
- 16GB eMMC Flash and 256MB QSPI Flash
- 2 x 240pin High-Speed Connectors with 98 user IOs
Documents
Documents
Design Support
Software
×
Document
Documents
Design Support
Software
×
- Brochure
- SOM Datasheet
- DevKit User Guide
- Quick Start Guide
- Fansink Datasheet
- Fansink Datasheet
- Fansink Datasheet
Document
- Brochure
- SOM Datasheet
- DevKit User Guide
- Quick Start Guide
- Fansink Datasheet
- Fansink Datasheet
- Fansink Datasheet
Design Support
- Selection Guide
- SOM 3D STEP
- SOM 3D STEP
- Library Symbol
- CAD Symbol
- CAD Symbol
- CAD Symbol
Design Support
- Selection Guide
- Selection Guide
- Selection Guide
- Selection Guide
- Selection Guide
- Selection Guide
- Selection Guide
Design Support
- Selection Guide
- Selection Guide
- Selection Guide
- Selection Guide
- Selection Guide
- Selection Guide
- Selection Guide
- Specification
- Development Kit
- Thermal & Mechanical
- Custom Design
Features | Details |
---|---|
Versal SoC | Xilinx VersalTM AI Edge/Prime SFVA784 package |
PMIC | Dialog’s DA9062 PMIC with RTC |
Clock | Clock Synthesizer |
Memory & Storage | 4GB LPDDR4 |
Other Features | 10/100/1000 Ethernet PHY |
Board to Board Connector1 Interfaces(240pin) | From PL Block
|
Board to Board Connector2 Interfaces(240pin) | From PL Block
From PS Block
|
General Features |
|

- FMC+ High Serial Pin Count (HSPC) Connector
- 4K HDMI 2.0 IN and OUT through HDMI Connector
- 12G SDI Video IN and OUT through HD BNC Connector
- Dual Gigabit Ethernet through RJ45MagJack
- USB Type-C for JTAG and PS Debug port
- USB 2.0 Interface through USB Type C Connector
- Micro SD
- PMOD Connector
- 60 Pin GPIO Header (For PS IOs)
- Operating Temperature: -20°C to +85°C
- Form Factor: 120mm x 120mm
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