AgilexTM 7 R31B/C SoC FPGA System on Module

  • AgilexTM 7 I-Series from AGI 019 to AGI 027
  • AgilexTM 7 F-Series from AGF 019 to AGF 027
  • 8GB DDR4 with ECC for HPS, 2 x 8GB DDR4 with ECC for FPGA
  • 32GB eMMC Flash Expandable up to 128GB, 1Gb QSPI Flash
  • Up to 2692K Logic Elements
  • 8 x FHT Transceivers up to 116Gbps, 64 x FGT Transceivers up to 58Gbps and up to 126LVDS/252SE FPGA IOs
  • Agilex7 R31B/C SoM Banner image
  • Agilex7 R31B/C SoM Top view image
  • Agilex7 R31B/C SoM Bottom view

Documents

Document

Document

Design Support

Design Support

Design Support

  • Specification
  • Development Kit
  • Thermal & Mechanical
  • Custom design
FeaturesDetails
On Module Features

Compatible R31B/C Package Family

    • Compatible Agilex 7 I-Series – Agilex AGI 019, AGI 023, AGI 022, AGI 027
    • Compatible Agilex 7 F-Series – Agilex AGF 019, AGF 023, AGF 022, AGF 027

Hard Processing System (HPS)

    • Quad-core 64-bit Arm Cortex-A53 up to 1.50 GHz

Field Programmable Gate Array (FPGA)

    • Up to 2,692,760 Logic elements
    • 8 x FHT transceivers up to 116Gbps (Only in R31B)
    • 64 x FGT transceivers up to 58Gbps

8GB DDR4 with ECC for HPS (64bit + 8bit)
2 x 8GB DDR4 with ECC for FPGA (64bit + 8bit)
On SOM PTP & SyncE Network Synchronizers
32GB eMMC (Expandable)
RGMII Ethernet PHY Transceiver
USB2.0 ULPI Transceiver

Board to Board Connectors Interfaces

From HPS (Hard Processor System)

    • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
    • USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
    • Debug UART x 1
    • SD x 1 (Optional)
    • I2C x 1
    • Data UART x 1

From SDM (Secure Device Manager)

    • JTAG x 1

From HPS to FPGA

    • SPI x 1
    • I2C x 1

From FPGA

    • 8 x FHT transceivers up to 116Gbps
    • 64 x FGT transceivers up to 58Gbps
    • FPGA IOs (Up to 126LVDS/252SE)
General Features
  • Power Input: 5V through B2B Connector
  • Form Factor: 120mm x 90mm (BRYN+)
  • BSP Support: Linux BSP/Quartus 22.4
  • Operating Temperature: -40°C to +85°C (Industrial)
  • Environment Specification: REACH & RoHS3 Compliant
Agilex 7 R31B_C Devkit_Side angle view.
  • QSFP Connector x 4 (2 x 400G, 1 x 200G & 1 x 100G)
  • FMC+ High Pin count (HPC) connector x 3 (3rd FMC+ supports only DIFF/SE IOs)
  • PCIe Gen4 x16 Connector x 1
  • 4K HDMI 2.0 IN & OUT through HDMI Connector
  • SDI Video IN & OUT through HD BNC Connector
  • PMOD Connectors x 1
  • Gigabit Ethernet through RJ45MagJack x 1
  • USB2.0 OTG through Type C connector x 1
  • Debug UART through Type C connector x 1
  • 20 Pin Header (for HPS IOs)
  • Micro SD Connector x 1
  • JTAG Connector x 1
  • Operating Temperature: -0°C to +85°C
  • Form Factor: 160mm x 210mm
Agilex 7 R31B/C Thermal Solution Top view image
Agilex 7 R31B/C Thermal Solution board Top view image

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Fan Sink solution for Agilex 7 SoC FPGA SOM.

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