AgilexTM 3 SoC FPGA System on Module

  • AgilexTM 3 C-Series family with M16A Package
  • HPS LPDDR4 – 32bit 4GB (Expandable up to 8GB)
  • 32GB eMMC Flash (Expandable up to 128GB), 1Gb QSPI Flash
  • 4 x Transceivers up to 12.5Gbps
  • Up to 135,110 Logic Elements
  • PCle Gen3 connectivity interface
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Documents

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Document

Design Support

Design Support

Design Support

  • Specification
  • Custom design
FeaturesDetails
Agilex 3 SoC FPGA

Compatible C-Series M16A Package Family

    • Group C: A3C 100/A3C 135

Hard Processing System (HPS)

    • Dual-core Arm Cortex-A55 up to 800 MHz

Field Programmable Gate Array (FPGA)

    • Up to 1,35,100 Logic elements
    • 4 x GTS transceivers up to 12.5Gbps
Memory

HPS LPDDR4 – 32bit 4GB (Expandable up to 8GB)
32GB eMMC (Expandable up to 128GB)
1Gb QSPI Flash (Expandable up to 2Gb)

Other On SOM Features

2.5G Ethernet PHY Transceiver
USB2.0 ULPI Transceiver
Clock Synthesizer
JTAG Header
FAN Header

Board to Board Connector1 Interfaces(240pin)

From FPGA

    • 4 x GTS transceivers up to 12.5Gbps
    • FPGA HSIO 60 pair/120SE IOs and 38 HVIOs
Board to Board Connector2 Interfaces(240pin)

From HPS (Hard Processor System)

    • RGMII x 1
    • USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
    • Debug UART x 1
    • I2C x 1
    • Data UART x 1
    • SD x 1 (Optional)

From SDM (Secure Device Manager)

    • JTAG x 1
    • AS x 1 (Active Serial x4)

From HPS to FPGA

    • 2.5G Ethernet x 1 (through On-SOM Ethernet PHY)
    • USB 3.0 x 1
    • I2C x 1
General Features
  • Power Input: 5V through B2B Connector
  • Form Factor: 50mm x 60mm (REN)
  • BSP Support: Linux
  • Operating Temperature: -40°C to +85°C (Industrial)
  • Environment Specification: REACH & RoHS3 Compliant

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