AgilexTM 7 R24C SoC FPGA System on Module

  • AgilexTM 7 SoC – AGF 006/008/012/014/019/023/022/027
  • 8GB DDR4 with ECC for HPS & 8GB DDR4 with ECC for FPGA (64bit + 8bit)
  • 32GB eMMC (Expandable)
  • Up to 2,692,760 Logic Elements
  • 2 x 144Mb QDR-IV For FPGA (18bit)
  • 32 x FGT transceivers up to 58Gbps
  • Agilex 7 R24C SoM Banner view image
  • Agilex 7 R24C SoM Top view image
  • Agilex 7 R24C SoM Bottom view image
  • Agilex 7 R24C SoM Side view image

Documents

Document

Document

Design Support

Design Support

Design Support

  • Specification
  • Development Kit
  • Thermal & Mechanical
  • Custom design
FeaturesDetails
On Module Features

Agilex 7 R24C SoC FPGA:
Compatible R31B/C Package Family

    • Compatible Agilex 7 I-Series – Agilex AGI 019, AGI 023, AGI 022, AGI 027
    • Compatible Agilex 7 F-Series – Agilex AGF 019, AGF 023, AGF 022, AGF 027

Hard Processing System (HPS)

    • Quad-core 64-bit Arm Cortex-A53 up to 1.50 GHz

Field Programmable Gate Array (FPGA)

    • Up to 2,692,760 Logic elements
    • 8 x FHT transceivers up to 116Gbps (Only in R31B)
    • 64 x FGT transceivers up to 58Gbps

8GB DDR4 with ECC for HPS (64bit + 8bit)
2 x 8GB DDR4 with ECC for FPGA (64bit + 8bit)
On SOM PTP & SyncE Network Synchronizers
32GB eMMC (Expandable)
RGMII Ethernet PHY Transceiver
USB2.0 ULPI Transceiver

Board to Board Connectors Interfaces

From HPS (Hard Processor System)

    • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
    • 0 OTG x 1 (through On-SOM USB2.0 transceiver)
    • Debug UART x 1
    • SD x 1 (Optional)
    • I2C x 1
    • Data UART x 1

From SDM (Secure Device Manager)

    • JTAG x 1

From HPS to FPGA

    • SPI x 1
    • I2C x 1

From FPGA

    • 8 x FHT transceivers up to 116Gbps
    • 64 x FGT transceivers up to 58Gbps
    • FPGA IOs (Up to 126LVDS/252SE)
General Features
  • Power Input: 5V through B2B Connector
  • Form Factor: 120mm x 90mm (BRYN+)
  • BSP Support: Linux BSP for ARM Cortex /Quartus 22.4
  • Operating Temperature: -40°C to +85°C (Industrial)
  • Environment Specification: REACH & RoHS3 Compliant
Agilex 7 R24C Devkit side view image
  • QSFP Connector x 4 (2 x 400G, 1 x 200G & 1 x 100G)
  • FMC+ High Pin count (HPC) connector x 3 (3rd FMC+ supports only DIFF/SE IOs)
  • PCIe Gen4 x16 Connector x 1
  • 4K HDMI 2.0 IN & OUT through HDMI Connector
  • SDI Video IN & OUT through HD BNC Connector
  • PMOD Connectors x 1
  • Gigabit Ethernet through RJ45MagJack x 1
  • USB2.0 OTG through Type C connector x 1
  • Debug UART through Type C connector x 1
  • 20 Pin Header (for HPS IOs)
  • Micro SD Connector x 1
  • JTAG Connector x 1
  • Operating Temperature: -0°C to +85°C
  • Form Factor: 160mm x 210mm
Agilex 7 R24C Thermal Solution board Top view image
Agilex 7 R24C Thermal Solution Top view image

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Fan Sink solution for Agilex 7 SoC FPGA SOM.

Versal AI Edge

To power AI applications from the edge to the endpoint.

Versal AI Edge

To power AI applications from the edge to the endpoint.

Versal AI Edge

To power AI applications from the edge to the endpoint.

Versal AI Edge

To power AI applications from the edge to the endpoint.
Product Design Process banner image

Product Design Process

Our design process transforms your vision into reality with innovation, quality, and collaboration.

Certification & Qualification banner image

Certification & Qualification

Ensuring Compliance, Quality, and Trust Through Certification & Qualification.

Product Lifecycle Management banner image

Product Lifecycle Management

Ensuring Longevity, Reliability, and Seamless Product Evolution.

Mechanical Services Banner image

Mechanical Services

Precision Engineering for Reliable, High-Performance Mechanical Solutions.

Related Products

Versal AI Edge

Versal AI Edge

Versal AI Edge

  • Video
  • News
  • Press Releases

The Need for Thermal Management in Embedded Boards and Solutions

FPGA System Design Article Banner image

FPGA System Design: Why Choose FPGA SoM for Optimal FPGA System Design

Agilex 5 For AI Application Article Banner image

Unlocking the Potential of Agilex 5 System on Module in AI Development

Intel Titanium Partner Article Banner image

Intel Elevates iWave to Titanium Partnership Level

iWave Launches iW-RainboW-G58M: Intel Agilex® 5 FPGA System on Module

Scroll to Top