VirtexTM UltraScale+TM FPGA System on Module

VirtexTM UltraScale+TM FPGA System on Module

  • Xilinx VirtexTM UltraScale+TM FPGA with B2104 package
  • Dual 4GB FPGA-DDR4 with ECC (64bit + 8bit)
  • 48 channels of FPGA GTY transceivers up to 32Gbps
  • Two 240pin High-Speed Connectors with 172 user IO
  • Dual ARM Cortex-A7 core processor of 1.2GHz speed
  • 2GB DDR4 for CPU with ECC (32bit+4bit)
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  • Specification
  • Development Kit
  • Thermal & Mechanical
  • Custom Design
FeaturesDetails
VirtexTM UltraScale+TM FPGA SoM

Compatible FPGAs with B2104 package:

  • VirtexTM UltraScale+TM: VU5P, VU7P, VU9P, VU11P and VU13P
  • VirtexTM UltraScaleTM: VU080, VU095, VU125, VU160, VU190
  • KintexTM UltraScale+TM: KU19P
  • KintexTM UltraScaleTM: KU095 and KU115

Up to 3,780K Logic Cells
GTY Transceivers x 48 @32 Gbps*
46 LVDS/92 SE FPGA IOs
80 SE FPGA IOs

CPU

Dual Arm Cortex-A7 core processor
Operation frequency of 1.2GHz
QorIQ Trust Architecture and Arm TrustZone
High-speed serial interfaces (SERDES) x 4 @6Gbps

Memory & Storage

Dual 64-bit DDR4 with ECC from FPGA
128MB QSPI Flash
32bit DDR4 with ECC from CPU
256MB parallel NOR Flash
4MB MRAM
512KB SRAM via SPI

On SoM Features

10/100/1000 Ethernet PHY
Temperature Sensor
TPM2.0 Module via SPI

Board to Board Connector2 Interfaces(240pin)

FPGA GTY Transceiver x 4 up to 16Gbps
46 LVDS/92 SE FPGA IOs
USB 3.0 x 1
6Gbps SerDes x1 (PCIe/SATA/SGMII)
Gigabit Ethernet x 1
USB2.0 x 1
I2C x 2
Debug UART
UART x 2
JTAG

Board to Board Connector3 Interfaces(240pin)

FPGA GTY Transceiver x24 up to 32Gbps*

Board to Board Connector4 Interfaces(80pin)

FPGA GTY Transceiver x8 up to 32Gbps

General Features
  • Power Input: 5V through B2B Connector
  • Form Factor: 110mm x 75mm (OREN+)
  • BSP Support: Linux/Vivado22.2
  • Operating Temperature: -40°C to +85°C (Industrial)
  • Environment Specification:REACH & RoHS3 Compliant

*One lane of FPGA GTY transceiver is used for PCIe interface between FPGA and ARM Processor

Virtex UltraScale+ FPGA Devkit side view image
  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • 10G SFP+ Connector
  • SDI IN/OUT Connector
  • HDMI IN/ OUT Connector
  • FMC High Pin Count (HPC) Connector
  • FMC+ High Pin Count (HPC) Connector
  • Dual PMOD Connector
  • PCIe Gen2 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Gigabit Ethernet through RJ45 MagJack
  • USB2.0 OTG through MicroAB Connector
  • Debug UART through USB MicroAB Connector
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 140mm x 170mm
Kintex UltraScale Thermal Solution Top view image
Kintex UltraScale Thermal Solution Top view image

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for VU13P based FPGA SoM.

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