ZU48/47/43/28/27/25DR RFSoC System on Module

  • ZynqTM Ultrascale+TM RFSoC family with FFVG1517 Package
  • Compatible with ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR devices
  • 8GB DDR4 RAM for PS with ECC & 8GB DDR4 RAM for PL
  • 32GB eMMC Flash Expandable up to 128GB & 256MB QSPI Flash
  • Integrated SD-FEC IP Block
  • Up to 930 Logic cells & 425K LUTs

Documents

Document

Document

Design Support

Design Support

Design Support

  • Specification
  • Thermal & Mechanical
  • Custom Design
FeaturesDetails
CPU

ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR

Processing System (PS)

    • Quad Arm Cortex-A53 @1.3GHz
    • Dual Cortex-R5F @533MHz

Programming Logic (PL)

    • Up to 930 Logic cells & 425K LUTs
    • PL GTY High Speed Transceivers x 16 @28.21 Gbps
Memory

64bit, 8GB DDR4 RAM for PS with ECC
64bit, 8GB DDR4 RAM for PL

Storage

32GB eMMC Flash Expandable up to 128GB
256MB QSPI Flash

Board to Board Connector1 Interfaces (400pin)

ADC: 16 x ADC Channels up to 2.5Gsps
DAC: 16 x DAC Channels up to 10Gsps
PL IOs: PL IOs – 164 IOs

    • HP Bank IOs – up to 70LVDS/140SE
    • HD Bank IOs – up to 12LVDS/24SE
Board to Board Connector2 Interfaces (400pin)

From PL Block

    • 16 x PL-GTY High Speed Transceivers (up to 28.21Gbps)
    • PL Control Signal

From PS Block

    • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
    • USB 2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
    • SPI/QSPI X 1 Port (Optional)
    • CAN x 1, I2C x 2, SD x 1
    • Debug UART x 1, Data UART x 1, PS JTAG
    • RGMII Interface or ULPI Interface x 1
    • PS -GTR High speed Transceivers x 4 (upto 6Gbps)
    • PS-Control Signals
    • SYSMON(Optional)

Clock signals

    • 10MHz Clock IN, 1 PPS IN
    • 10 MHz Clock out, 1 PPS Clock Out
    • Synthesized Clock out from Clock synthesizer
    • Synthesized Clock into Clock Synthesizer
General Features
  • Power Input: 12V through B2B Connector2
  • Form Factor: 82mm x 100mm (BRYN)
  • BSP Support: Linux BSP- Petalinux/vivado 2022.2
  • Operating Temperature: -40°C to +85°C (Industrial)
  • Environment Specification: REACH & RoHS3 Compliant
  • Compliance: CE*

For any highly integrated System on Modules, thermal design is very important factor. iWave Global Supports heat Spreader and Fan Sink solution for RFSoC based System on Module.

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