ZU49/ZU39/ZU29DR RFSoC System on Module

  • ZynqTM UltraScale+TM RFSoC family with FFVF1760 Package
  • Compatible with ZU49/ZU39/ZU29DR devices
  • 8GB DDR4 RAM for PS with ECC & 8GB DDR4 RAM for PL
  • 32GB eMMC Flash Expandable up to 128GB
  • 16 ADC Channels support up to 2.5Gsps
  • 16 DAC Channels support up to 10Gsps

Documents

Document

Document

Design Support

Design Support

Design Support

  • Specification
  • Development Kit
  • Thermal & Mechanical
  • Custom Design
FeaturesDetails
CPU

RFSoC ZU49/ZU39/ZU29DR
Processing System (PS)

    • Quad Arm Cortex-A53 @1.3GHz,
    • Dual Cortex-R5F @533MHz

Programming Logic (PL)

    • Up to 930 Logic cells & 425K LUTs
    • PL GTY High Speed Transceivers x 16 @28.21 Gbps
Memory

8GB DDR4 RAM for PS with ECC
8GB DDR4 RAM for PL

Storage

32GB eMMC Flash Expandable up to 128GB

Board to Board Connector1 Interfaces (400pin)

ADC: 16 x ADC Channels up to 2.5Gsps
DAC: 16 x DAC Channels up to 10Gsps
PL Ios: PL IOs – 188 IOs

    • HP Bank IOs – up to 70LVDS/140SE
    • HD Bank IOs – up to 24LVDS/48SE
Board to Board Connector2 Interfaces (400pin)

From PL Block

    • 16 x PL-GTY High Speed Transceivers (up to 28.21Gbps)
    • PL Control Signal

From PS Block

    • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
    • USB 2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
    • SPI/QSPI X 1 Port (Optional)
    • CAN x 1, I2C x 2, SD x 1
    • Debug UART x 1, Data UART x 1
    • PS JTAG
    • RGMII Interface or ULPI Interface x 1
    • PS -GTR High speed Transceivers x 4 (upto 6Gbps)
    • PS-Control Signals
    • SYSMON(Optional)

Clock signals

    • 10MHz Clock IN
    • 1 PPS IN
    • 10 MHz Clock out
    • 1 PPS Clock Out
    • Synthesized Clock out from Clock synthesizer
General Features
  • Power Input: 12V through B2B Connector2
  • Form Factor: 100mm x 90mm (BRYN)
  • BSP Support: Linux BSP: Petalinux/vivad 2022.1
  • Operating Temperature: -40°C to +85°C (Industrial Grade)
  • Environment Specification: REACH & RoHS3 Compliant
  • Compliance: CE*

RF DAC/ADC Specifications:

  • 8 RF RT SMA connectors with Balun(BW-800MHz-1GHz)
  • 8 RF ST SMA connectors with Balun(BW-800MHz-1GHz)
  • 8RF ST SMA connectors with Balun(BW-700MHz-1.6GHz)
  • 8 RF ST SMA connectors with Balun(BW-10MHz-3GHz)

High Speed and Interface Specifications:

  • PCIe Gen3 x8 Edge Connector.
  • FMC+ High Pin count(HPC) connector
  • 4 SMA Straight angled connector for Clocks(10Mhz, 1PPS, SYS-CLK IN/Out)
  • NVMe PCIe Gen2 x2 M.2 Connector
  • Gigabit Ethernet through RJ45MagJack
  • Debug & DATA UART/JTAG through Type-C Connector
  • Operating Temperature: 30°C to +85°C
  • Form Factor: 254mm x 111.15mm (3/4 Length PCIe Card)

Thermal design is a crucial factor for highly integrated System on Modules. iWave offers Heat Spreader and Fan Sink solutions for RFSoC-based SoMs to ensure optimal thermal management.

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