ZynqTM UltraScale+TM ZU15/ZU9/ZU6 System on Module

ZynqTM UltraScale+TM ZU15/ZU9/ZU6 System on Module

    • Zynq™ UltraScale+™ MPSoC family with FFVC900 package
    • Compatible with ZU15/ZU9/ZU6 EG/CG devices
    • 4GB DDR4 for PS with ECC, 2GB DDR4 for PL & 32GB eMMC Flash
    • 16 Channels GTH Transceivers up to 16.3Gbps
    • 4 Channels GTR Transceivers up to 6Gbps
    • 48 LVDS Pairs/ 96 SE IOs, 46 SE FPGA IOs
  • Zynq UltraScale ZU15ZU9ZU6 SoM Thumbnail iWave Global
  • Zynq UltraScale ZU15ZU9ZU6 SoM Top View iWave Global
  • Zynq UltraScale ZU15ZU9ZU6 SoM Bottom View iWave Global

Documents

  • Specification
  • Development Kit
  • Custom Design
FeaturesDetails
ZU15EG ZU9/6 EG/CG - ZynqTM Ultrascale+TM MPSoC (FFVC900)

Processing System (PS/Processor)

  • Quad-core ARM Cortex-A53 MPCore @1.5GHz
  • Dual-core ARM Cortex-R5 MPCore @600MHz
  • Arm Mali-400MP2 GPU

Programming Logic (PL/FPGA)

  • Up to 747K Logic cells & 341K LUTs
  • High Speed GTH Transceivers x 16 (Up to 16.3Gb/s)
RAM Memory

PS: 64bit, 4GB DDR4 RAM with ECC (Expandable up to 8GB)
PL/FPGA: 16bit, 1GB DDR4 RAM (Expandable up to 2GB)

On Board Flash

8GB eMMC Flash for boot & storage (expandable up to 128GB)
EEPROM (4Kbit)

Other Interfaces

Gigabit Ethernet PHY Transceiver (PTP supported)
USB2.0 PHY Transceiver
6 Output programable clock synthesizer

240pin High-Speed Board to Board Connector 1 Interfaces

From PS Block

  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • GEM3 RGMII Interface or ULPI Interface x 1
  • CAN interface x 2

From PL Block

  • High Speed GTH Transceiver Lanes x 12 (Up to 16.3Gbps)
  • HD Bank IOs – Up to 23LVDS/46 Single Ended IO’s
  • ADC Input pins- Up to 20 Differential/Single Ended from HD Banks
240pin High-Speed Board to Board Connector 2 Interfaces

From PS Block

  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • 0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
  • SD (4bit) x 1
  • Debug UART & Data UART x 1
  • SPI x 1
  • I2C x 2 Port
  • JTAG x 1

From PL Block

  • High Speed GTH Transceiver Lanes x 4 (Up to 16.3Gbps)
  • HP Bank IOs – 48 LVDS/96 Single Ended IO’s
  • ADC Input pins – Up to 32 Differential/Single Ended from HP Banks
General Features

Power Input: 5VDC +/- 5% input from B2B Connector2
Form Factor: 95mm X 75mm(OREN)
BSP Support: Linux
Operating Temperature: -40°C to +85°C (Industrial)
Environment Specification: REACH & RoHS3 Compliant
Compliance: CE*

*Under Progress

  • 10G Ethernet through SFP+ Connector
  • 3G SDI Video IN through HD BNC Connector
  • 3G SDI Video OUT through HD BNC Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP1.2a Display Port Connector
  • PCIe Gen2 x4 Connector
  • M.2 SATA 3.1 Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through Micro-AB Connector
  • USB 2.0 OTG through TypeC Connector
  • USB 3.0 through TypeC connector
  • Standard SD Connector
  • CAN Header
  • Dual PMOD Connector
  • JTAG Header
  • RTC Coin Cell Holder
  • Operating Temperature: -20°C to +85°C
  • Form Factor: 130mm x 140mm

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