Zynq^TM UltraScale+^TM ZU19/ZU17/ZU11 System on Module

Zynq^TM UltraScale+^TM MPSoC family with FFVC1760 package
Compatible with ZU19/ZU17/ZU11 EG devices
4GB DDR4 RAM for PS with ECC & 4GB DDR4 RAM for PL
8GB eMMC Flash Expandable up to 128GB
Up to 1143K Logic cells & 522K LUTs
16 GTY Transceivers, 32 GTH Transceivers, 4 GTR Transceivers and 142 IOs

Documents

Features	Details
CPU	ZU19/ZU17/ZU11 EG Processing System (PS) Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz Arm Mali-400MP2 GPU @677MHz Programming Logic (PL) Up to 1143K Logic cells & 522K LUTs PL GTH High Speed Transceivers x 16 @16.3 Gbps
Memory	64bit, 4GB DDR4 RAM for PS with ECC 64bit, 4GB DDR4 RAM for PL
Storage	8GB eMMC Flash Expandable up to 128GB
Two High Density Board to Board Connectors Interfaces	PL-GTY High Speed Transceivers (up to 32.75Gbps) x 16 PL-GTH High Speed Transceivers (up to 16.3Gbps) x 16
Two 240pin High Speed Board to Board Connectors Interfaces	From PL Block: PL-GTH High Speed Transceivers (up to 16.3Gbps) x 16 PL IOs – 142 IOs HP Bank IOs – Up to 48 LVDS IOs/96 Single ended (SE) HD Bank IOs – Up to 23 LVDS IOs/46 Single ended (SE) GC Global Clock Input pins – Up to 15 LVDS/SE ADC Input pins – Up to 16 Differential/Single Ended From PS Block: PS-GTR High Speed Transceivers (up to 6Gbps) x 4 Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY) USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver) RGMII Interface or ULPI Interface x 1 SD (4bit) x 1 SPI x 1, CAN x 2, I2C x 2 Debug UART x 1, Data UART x 1 PS JTAG
General Features	Power Input: 5V through B2B Connector2 Form Factor: 75mm x 110mm (OREN+) BSP Support: Linux BSP – Petalinux 2023.2 BareMetal BSP – Vivado 2020.1 Operating Temperature: -40°C to +85°C (Industrial) Environment Specification: REACH & RoHS3 Compliant Compliance: CE*

100G Ethernet though QSFP28/QSFP+ Connector
112G FireFly Connector
10G Ethernet through SFP+ Connector
12G SDI Video IN through HD BNC Connector
12G SDI Video OUT through HD BNC Connector
4K HDMI 2.0 IN through HDMI Connector
4K HDMI 2.0 OUT through HDMI Connector
Dual FMC High Pin Count (HPC) Connector
DP 1.2a Display Port Connector
PCIe Gen2 x4 & M.2 SATA 3.1 Connector
USB 3.0 OTG through TypeC Connector
Dual Gigabit Ethernet through RJ45MagJack
USB2.0 OTG through MicroAB Connector
Standard SD & Dual PMOD Connector
CAN Header & 20 Pin Header (for PS IOs)
Operating Temperature: -20°C to +85°C
Form Factor: 140mm x 170mm

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for ZU19/17/11EG Zynq UltraScale+ MPSoC System on Module.