ZynqTM UltraScale+TM ZU7/ZU5/ZU4 System on Module

ZynqTM UltraScale+TM ZU7/ZU5/ZU4 System on Module

  • Zynq™ UltraScale+™ MPSoC Family with FBVB900 Package
  • Compatible with Zynq UltraScale+ ZU7/5/4 CG/EG/EV Devices
  • Up to 504K Logic Cells & 230K LUTs
  • 4GB DDR4 with ECC for PS, 1GB DDR4 for PL & 8GB eMMC Flash
  • 4 PS GTR Transceivers & 16 GTH Transceivers
  • 2 x 240pin High Speed Connectors with 142 user IOs

 

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  • ZU7ZU5ZU4 SoM Top View iWave Global
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Documents

  • Specification
  • Development Kit
  • Thermal & Mechanical
  • Custom Design
FeaturesDetails
ZU7/ZU5/ZU4 - ZynqTM Ultrascale+TM MPSoC

Processing System (PS)

  • Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz
  • 264/H.265 Video Encoder/Decoder (VCU)
  • Arm Mali-400MP2 GPU @677MHz

Programming Logic (PL)

  • Up to 504K Logic cells & 230K LUTs
  • PL GTH High Speed Transceivers x 16 @16.3 Gbps
  • 64bit, 4GB DDR4 RAM with ECC for PS (Upgradable up to 8GB)
  • 16bit, 2GB DDR4 RAM for PL (Upgradable up to 4GB)
  • 8GB eMMC Flash (Upgradable)
  • RGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver
Board to Board Connectors Interfaces

From PS Block

  • PS-GTR High Speed Transceivers (upto 6Gbps) x 2
  • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
  • 0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • RGMII Interface or ULPI Interface x 1
  • SD (4bit) x 1, SPI x 1, CAN x 2
  • Debug UART x 1, Data UART x 1
  • I2C x 2, PS JTAG

From PL Block

  • PL-GTH High Speed Transceivers (upto 16.3Gbps) x 16
  • PL IOs – 142 IOs
  • HP Bank IOs – Up to 48 LVDS IOs/96 Single ended (SE)
  • HD Bank IOs – Up to 23 LVDS IOs/46 Single ended (SE)
  • GC Global Clock Input pins – Up to 15 LVDS/SE
General Features

Power Input: 5V through B2B Connector
Form Factor: 95mm X 75mm(OREN)
BSP Support:

  • Linux BSP – Petalinux 2022.2
  • Baremetal BSP – Vivado 2020.1

Operating Temperature: -40°C to +85°C (Industrial)
Environment Specification: REACH & RoHS3 Compliant
Compliance: CE*

*Under Progress

  • 10G Ethernet through SFP+ Connector
  • 3G/12G SDI Video IN through HD BNC Connector
  • 3G/12G SDI Video OUT through HD BNC Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP1.2a Display Port Connector
  • PCIe Gen2 x4 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Standard SD Connector
  • CAN Header
  • Dual PMOD Connector
  • RTC Coin Cell Holder
  • Operating Temperature: -20°C to +85°C
  • Form Factor: 130mm x 140mm

Thermal design is a crucial factor for highly integrated System on Modules. iWave offers Heat Sink and Fan Sink solutions for the ZU7/5/4 Zynq UltraScale+ MPSoC SOM.

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