Kintex UltraScale+ System On Module

Kintex UltraScale+ System On Module

  • Kintex UltraScale+ FPGA with B2104 package
  • Compatible with KU19P, KU095, KU115 FPGA
  • Dual 4GB FPGA-DDR4 with ECC (64bit + 8bit)
  • 32 channels of FPGA GTY transceivers up to 32Gbps
  • Two 240pin High-Speed Connectors with 172 user IO
  • Dual ARM Cortex-A7 core processor of 1.2GHz speed
  • Kintex UltraScale FPGA SoM Banner view image
  • Kintex UltraScale FPGA SoM Top view image
  • Kintex UltraScale FPGA SoM Bottom view image
  • Kintex UltraScale FPGA SoM Side view image

Documents

  • Specification
  • Development Kit
  • Thermal & Mechanical
  • Custom Design
FeaturesDetails
Kintex UltraScale+ FPGA SoM

Compatible FPGAs with B2104 package:

    • Kintex UltraScale+; KU19P
    • Kintex UltraScale; KU095 and KU115
    • Virtex UltraScale+; VU5P, VU7P, VU9P, VU11P and VU13P
    • Virtex UltraScale; VU080, VU095, VU125, VU160, VU190

Up to 1,842K Logic Cells
GTY Transceiver x48 up to 32Gbps1
46 LVDS/92 SE FPGA IOs
80 SE FPGA IOs

CPU

Dual Arm Cortex-A7 core processor
Operation frequency of 1.2GHz
QorIQ Trust Architecture and Arm TrustZone
High-speed serial interfaces (SERDES) x4 @6Gbps

Memory & Storage

Dual 64-bit DDR4 with ECC from FPGA
128MB QSPI Flash
32bit DDR4 with ECC from CPU
256MB parallel NOR Flash
4MB MRAM
512KB SRAM via SPI

Other On SOM Features

10/100/1000 Ethernet PHY
Temperature Sensor
TPM2.0 Module via SPI

Board to Board Connector1 Interfaces(240pin)

FPGA GTY Transceiver x12 up to 16Gbps
80 SE FPGA Ios
6Gbps SerDes x2 (PCIe/SATA/SGMII)

Board to Board Connector2 Interfaces(240pin)

FPGA GTY Transceiver x4 up to 16Gbps
46 LVDS/92 SE FPGA IOs
USB 3.0 x1
6Gbps SerDes x1 (PCIe/SATA/SGMII)
Gigabit Ethernet x 1
USB2.0 x1
I2C x 2
Debug UART
UART x 2
JTAG

Board to Board Connector3 Interfaces(240pin)

FPGA GTY Transceiver x24 up to 32Gbps2

Board to Board Connector4 Interfaces(80pin)

FPGA GTY Transceiver x8 up to 32Gbps

General Features
  • Power Input: 5V through B2B Connector
  • Form Factor: 110mm x 75mm (OREN+)
  • BSP Support: Linux/Vivado 22.2 & Yocto Dunfell 3.1
  • Operating Temperature: -40°C to +85°C (Industrial)
  • Environment Specification: REACH & RoHS3 Compliant
Kintex UltraScale FPGA Devkit side view image
  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • FMC High Pin Count (HPC) Connector
  • FMC+ High Pin Count (HPC) Connector
  • PCIe Gen2 x1 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Dual PMOD Connector
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 140mm x 170mm
Kintex UltraScale Thermal Solution Top view image
Kintex UltraScale Thermal Solution Top view image

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for KU19P FPGA based SOM.

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