Agilex™ 5 SoC FPGA
System on Module
iG-G58M®
- Agilex™ 5 E-Series SoC FPGA System on Module (B32A Package)
- 32Bit 2GB LDDR4 for HPS and 2 x 32Bit 2GB LDDR4 for FPGA
- 32GB eMMC (Expandable) and 1Gb QSPI Configuration flash
- 24 high speed transceivers up to 28.1Gbps
- Up to 656K Logic elements
- 2.5G Ethernet PHY Transceiver for high speed connectivity
Documents
| Features | Details |
|---|---|
| Agilex™ 5 SoC FPGA | Compatible E-Series B32A Package Family
Hard Processing System (HPS)
Field Programmable Gate Array (FPGA)
|
| Memory Interfaces | 2GB LPDDR4 for HPS ( Expandable up to 8GB) 2 x 2GB LPDDR4 for FPGA (Expandable up to 8GB) 32GB eMMC (Expandable up to 128GB) 1Gb QSPI Flash 2Kb EEPROM |
| Other On SOM Features | 2.5G Ethernet PHY Transceiver USB2.0 ULPI Transceiver Clock Synthesizer JTAG Header (Optional) FAN Header |
| Board to Board Connector1 Interfaces(240pin) | From FPGA:
|
| Board to Board Connector2 Interfaces(240pin) | From HPS (Hard Processor System):
From SDM (Secure Device Manager):
From HPS to FPGA:
From FPGA:
|
| Board to Board Connector3 Interfaces (160pin) | From FPGA
|
| General Features | Power Input: 5V through B2B Connector Form Factor: 60mm X 70mm (REN+) BSP Support: Linux BSP for ARM Cortex /Quartus 25.1 Operating Temperature: -40°C to +85°C (Industrial) Environment Specification: RoHS & REACH3 Compliant |
Unified Development Platform for Agilex 3 & Agilex 5 SoMs
This development kit is designed with a common carrier architecture, allowing both Agilex 3 SoM and Agilex 5 SoM to be used on the same platform.
Users can evaluate, prototype, and scale designs by switching between Agilex SoMs without any hardware or mechanical changes.
- 2.5G Ethernet RJ45 MagJack
- Gigabit Ethernet RJ45 MagJack
- Micro SD Connector (Optional)
- TypeC USB connector for Debug
- JTAG Connector
- 60-Pin PS Header (GPIOs)
- PCIe Gen3 x4
- USB3.0 + USB2.0 through TypeC
- DP (2 lane)
- FMC+ Connector
- PMOD Connector
- Form Factor : 120mm x 120mm
- Operating Temperature: -20°C to +85°C
*either HDMI OUT/IN or SDI IN/OUT supported at a time
Buy Now
For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Fan Sink solution for Agilex 5 SoC FPGA SOM.
FAQs
Agilex™ System on Modules provide a production-ready FPGA platform with proven signal integrity, DDR tuning, and power sequencing. They reduce development risk, shorten design cycles, and accelerate time-to-market for high-performance embedded systems.
Agilex™ FPGA system on modules are supported with a Yocto-based Linux BSP including bootloader, kernel, and root filesystem. They also support bare-metal development through the Altera HAL for Nios® V (RISC-V) processors.
Yes. Agilex™ solutions support Remote System Update (RSU) with factory and application image management, enabling secure fallback, trusted recovery, and reliable field upgrades.
- Ultra-High-Speed Networking & Compute Scalability
- Precision Time Synchronization & Deterministic Networking
- RF-Optimized Clocking & Power Architecture
- Compact, Pin-Compatible & Deployment-Ready Designs
With high-speed PCIe connectivity, dynamic FPGA reconfiguration, and robust Linux support, Agilex™ enables acceleration for AI, networking, data centers, and high-performance embedded systems.
