Versal™ Premium
System on Module
iG-G63M®
- Versal™ Premium SoC Compatible with VP1552, VP1502, VP1402, VP1202, and VP1102 Devices
- Up to 3763Logic cells and 1720K LUTs
- 56 Channels of GTM Transceiver up to 112Gbps PAM4
- 12 Channels of GTYP transceivers up to 32Gbps NRZ
- 16 Channels of GTYP LPD transceivers for PCIe GEN5
- Up to 96LVDS/192SE from XPIOs
Documents
| Features | Details |
|---|---|
| SoC/FPGA | VersalTMPremium SoC with VSVA2785 package Compatible with VP1552, VP1502, VP1402, VP1202, and VP1102 Devices Dual-core Arm Cortex-A72 @1.7GHz Dual-core Arm Cortex-R5F @800MHz Up to 3763Logic cells and 1720K LUTs |
| Memory | Three 64bit, 8GB LPDDR4 2Kb EEPROM |
| Storage | 256MB QSPI flash 32GB eMMC Flash |
| Board to Board Connector Interfaces | From PL Block
From PS Block
|
| Other On SoM Features | 10/100/1000 Ethernet PHY with PTP USB Transceiver PHY Programmable Clock Synthesizer 32.768KHz crystal for RTC FAN Header |
| Software Features | Yocto / PetaLinux BSP with Vivado hardware support Linux driver support for PL (Programmable Logic) and DMA subsystems High-speed I/O and networking stack support (PCIe, Ethernet, etc.) RF data converter support (specific to Versal RF devices) Bare-metal and real-time low-latency application support Vitis development environment for acceleration |
| General Features | Power Input: 12V through B2B Connector Form Factor: 115mm x 82mm (BRYNc+) BSP Support: Petalinux 2024 or above Operating Temperature: -40°C to +85°C Environment Specification: REACH & RoHS3 Compliant |
- Dual Stacked QSFP112G Connector for 100G/400G/600G Ethernet interfaces
- Dual FMC+ HSPC Connector with high-speed transceivers and high-performance PL IOs
- FMC+ HSPC connector with high-performance and high-density PL IOs
- PCIe x16 Connector for CPM5 PCIe Interface
- PCIe x4 Connector for PL PCIe Gen4/Gen5 interface
- 12G SDI Video IN through HD BNC Connector
- 12G SDI Video OUT through HD BNC Connector
- 4K HDMI 2.0 IN through HDMI Connector
- 4K HDMI 2.0 OUT through HDMI Connector
- PMOD Connector for PL IOs
- USB TypeC for debug and JTAG interfaces
- USB 2.0 OTG through TypeC Connector
- Dual Gigabit Ethernet through RJ45 Magjack
- Micro SD connector for booting and storage
- Coin cell battery connector for RTC backup power
- Boot media controlling DIP switch and Hard Reset Switch
- GPIO Header for PS and PL IOs
- Operating Temperature: -20°C to +70°C
- Form Factor: 210mm x 160mm
For any highly integrated System on Modules, thermal design is very important factor. iWave supports Fan Sink solution for VersalTM premium SoM.
FAQs
The AMD Versal™ Adaptive SoC is a next-generation adaptive computing platform that combines CPUs, programmable logic (FPGA), AI engines, DSP engines, and high-bandwidth networking on a single device.
Unlike traditional SoCs or FPGAs, Versal™ devices integrate multiple compute engines connected through a high-speed Network-on-Chip (NoC). This architecture allows developers to run AI, signal processing, and embedded applications efficiently in a single platform.
Yes. Versal™ AI Edge devices integrate AI engines and programmable logic to accelerate machine learning inference, vision processing, and real-time analytics. This makes them ideal for edge AI applications where low latency and high performance are required.
Versal™ SoM platforms support multiple high-speed interfaces including PCIe Gen4 and Gen5, Ethernet connectivity, and multi-gigabit transceivers that can reach speeds up to 112 Gbps depending on the device family.
Yes. With support for high-speed transceivers, PCIe Gen5, and MAC interfaces up to 600G, Versal™ SOM platforms are well suited for networking, data processing, and communication infrastructure applications.
Versal™ devices are more advanced than traditional FPGAs because they combine multiple processing engines in a single platform. They integrate CPUs, programmable logic, AI engines, and DSP blocks to handle different types of workloads efficiently.
Key benefits include:
- Heterogeneous compute architecture for flexible processing
- Software-programmable acceleration for faster development
- High-bandwidth and deterministic data movement
- Integrated high-speed transceivers for multi-gigabit connectivity
- Scalable platform for AI, networking, and embedded applications
