Documents
Design Support
Software
| Features | Details |
|---|---|
| SoC/FPGA | Kintex™ UltraScale+™ FPGA with B2104 Package Compatible with Kintex™ UltraScale+™: KU19P device and Kintex™ UltraScale™: KU095, KU115 System Logic cells up to 1,843K Logic cells and up to 1,685K Configurable Logic Blocks Gen4 x8 & Gen3 x16 Integrated PCIe block 100G Ethernet MAC cores for high-speed connectivity |
| CPU | Dual Arm Cortex-A7 core processor Operation frequency of 1.2GHz High-speed SerDes (PCIe/SATA/SGMII) x 4 |
| Memory | Dual 64bit, 4GB DDR4 with 8bit ECC for FPGA 32bit, 2GB DDR4 with 8bit ECC for CPU 512KB SRAM via SPI 16bit, 4MB MRAM for CPU |
| Storage | 128MB QSPI Flash for FPGA 16bit, 256MB NOR Flash for CPU |
| FPGA to CPU Interfaces | RGMII x1 UART x1 PCIe x1 Gen2 (Optional) |
| Board to Board Connector Interfaces | From FPGA:
From CPU:
|
| Other On SOM Features | TPM2.0 module Gigabit Ethernet PHY Transceiver Temperature Sensor Clock Synthesizer Fan Header |
| General Features |
|

- QSFP28/QSFP+/QSFP Connector for 40G/100G
- FireFly Connector x 1
- PMOD Connector x 2
- FMC High Pin Count (HPC) Connector x1
- FMC+ High Pin Count (HPC) Connector x1
- M.2 SATA Connector x1 from CPU
- PCIe Gen2 Connector via x4 connector from CPU
- USB2.0 OTG through Micro AB Connector x 1 from CPU
- USB 3.0 through Type-C Connector x 1 from CPU
- Gigabit Ethernet through RJ45MagJack x 1 from CPU
- Debug UART through USB Micro AB Connector x 1 from CPU
- Operating Temperature: -20°C to +70°C
- Form Factor: 140mm X 170mm


Thermal design is a crucial factor for highly integrated System on Modules. iWave offers Heat Sink and Fan Sink solutions for the Kintex UltraScale+ SOM.



