Agilex™ 7 R24C SoC FPGA
System on Module

iG-G51M®

  • Agilex™ 7 SoC F-Series AGF 006, AGF008, AGF012, AGF014, AGF019, AGF022, AGF023, and AGF027
  • Up to 2,692K Logic elements
  • 2 x 144Mb QDR-IV For FPGA (18bit)
  • 12 x FGT transceivers up to 58Gbps
  • 4 x FGT transceivers up to 32Gbps
  • 16 x FGT transceivers up to 17Gbps
  • Form factor 110mm x 75mm (OREN+) with 40°C to +85°C (Industrial)
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Features Details
Agilex 7 R24C SoC FPGA Compatible Agilex 7 F-Series – Agilex 7 AGF 006, AGF 008, AGF 012, AGF 014, AGF 019, AGF 022, AGF 023, AGF 027
Hard Processing System (HPS)

  • Quad-core 64-bit Arm Cortex-A53 up to 1.50 GHz

Field Programmable Gate Array (FPGA)

  • Up to 2,692K Logic elements
  • 12 x FGT transceivers up to 58Gbps
  • 4 x FGT transceivers up to 32Gbps
  • 16 x FGT transceivers up to 17Gbps (1 channel is Optional)

8GB DDR4 SDRAM (64bit + 8bit) with ECC for HPS (Expandable)
8GB DDR4 SDRAM (64bit + 8bit) with ECC for FPGA (Expandable)
2 x 144Mb QDR-IV (18bit) for FPGA
1Gb QSPI Flash (Expandable)
32GB eMMC Flash (Expandable)
4Kb EEPROM

Board to Board Connectors Interfaces From HPS (Hard Processor System)

    • RGMII X1
    • USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
    • Debug UART x 1
    • SD (4bit) x 1 (Optional)
    • I2C x 1
    • Data UART x 1 (With CTS and RTS)

From SDM (Secure Device Manager)

    • JTAG x 1
    • AS x 1(Active Serial x4)

From HPS to FPGA

    • I2C x 1
    • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)

From FPGA

    • 12 x FGT transceivers up to 58Gbps support Board to Board3 connector
    • 4 x FGT transceivers up to 32Gbps support Board to Board3 connector
    • 16 x FGT transceivers up to 17Gbps support Board to Board1 & 2 connector (1 channel is Optional)
    • FPGA IOs(Up to 75LVDS/150SE)
General Features
  • Power Input: 5V through B2B Connector
  • Form Factor: 110mm x 75mm (OREN+)
  • BSP Support: Linux BSP for ARM Cortex /Quartus 24.2
  • Operating Temperature: -40°C to +85°C (Industrial)
  • Environment Specification: REACH & RoHS3 Compliant
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  • Debug UART through USB Micro AB connector x 1
  • Gigabit Ethernet through RJ45 MagJack x 2
  • USB2.0 OTG through Micro AB connector or Type-C Connector x 1
  • Data UART (with CTS & RTS) x 1
  • Standard SD Connector (Optional)
  • SDI Video IN through HD BNC Connector x 1
  • SDI Video OUT through HD BNC Connector x 1
  • SFP+ Connector x 1
  • QSFP28/QSFP+/QSFP Connector x 1
  • FMC High Pin Count (HPC) Connector x 1
  • FMC+ High Pin Count (HPC) Connector x 1
  • Clock Synthesizers/Generators x 2
  • JTAG Connector x 1
  • 16-Bit IO Expanders x 3
  • I2C Expander x 1
  • 20 Pin GPIO Header x 1
  • Power ON/OFF DIP Switch x 1
  • Reset Pushbutton Switch x 1
  • RTC Coin Cell Holder x 1
  • 12V FAN Header x 1
  • Form Factor : 140mm X 170mm
  • Operating Temperature: -20°C to +85°C

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Precision Engineering for Reliable, High-Performance Mechanical Solutions.

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FAQs

Agilex™ System on Modules provide a production-ready FPGA platform with proven signal integrity, DDR tuning, and power sequencing. They reduce development risk, shorten design cycles, and accelerate time-to-market for high-performance embedded systems.

Agilex™ FPGA system on modules are supported with a Yocto-based Linux BSP including bootloader, kernel, and root filesystem. They also support bare-metal development through the Altera HAL for Nios® V (RISC-V) processors.

Yes. Agilex™ solutions support Remote System Update (RSU) with factory and application image management, enabling secure fallback, trusted recovery, and reliable field upgrades.

  • Ultra-High-Speed Networking & Compute Scalability
  • Precision Time Synchronization & Deterministic Networking
  • RF-Optimized Clocking & Power Architecture
  • Compact, Pin-Compatible & Deployment-Ready Designs

With high-speed PCIe connectivity, dynamic FPGA reconfiguration, and robust Linux support, Agilex™ enables acceleration for AI, networking, data centers, and high-performance embedded systems.

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