Zynq™ UltraScale+™ ZU19/ZU17/ZU11 MPSoC System on Module

iG-G35M®

  • ZynqTM UltraScale+TM MPSoC family Compatible with ZU19/ZU17/ZU11 EG devices
  • 4GB DDR4 RAM for PS with ECC, 4GB DDR RAM for PS without ECC and Dual 4GB DDR4 RAM for PL
  • 16 x PL GTY high-speed transceivers up to 32.75 Gbps
  • 32 x PL GTH high-speed transceivers up to 16.375 Gbps
  • Up to 1143K Logic cells & 522K LUTs
  • 4 x GTR transceivers and 142 user IOs
CONTACT SALES
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Documents

Features Details
SoC ZU19/ZU17/ZU11 EG
Processing System (PS)

    • Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz
    • Arm Mali-400MP2 GPU @677MHz

Programming Logic (PL)

    • Up to 1143K Logic cells & 522K LUTs
    • PL GTY High Speed Transceivers x 16 @32.75 Gbps
    • PL GTH High Speed Transceivers x 32 @16.375 Gbps
Memory 64bit, 4GB DDR4 RAM for PS with ECC (Expandable up to 8GB)
64bit, Dual 4GB DDR4 RAM for PL (Expandable up to 16GB)
Storage 8GB eMMC Flash (Expandable up to 128GB)
On Board Interfaces Gigabit Ethernet PHY Transceiver
USB2.0 PHY Transceiver
JTAG Header
Fan Header
240pin High-Speed Board to Board Connector 1 Interfaces From PS Block

    • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
    • GEM3 RGMII Interface or ULPI Interface x 1
    • CAN interface x 2

From PL Block

    • High Speed GTH Transceiver Lanes x 12 (Up to 16.375Gbps)
    • HD Bank IOs – Up to 46 Single Ended IO’s
    • ADC Input pins- Up to 20 Single Ended IOs from HD Banks
240pin High-Speed Board to Board Connector 2 Interfaces From PS Block

    • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
    • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
    • USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
    • SD (4bit) x 1
    • Debug UART & Data UART x 1
    • SPI x 1
    • I2C x 2 Port
    • JTAG x 1

From PL Block

    • High Speed GTH Transceiver Lanes x 4 (Up to 16.375Gbps)
    • HP Bank IOs – 48 LVDS/96 Single Ended IO’s
    • ADC Input pins – Up to 32 Differential/Single Ended from HP Banks
240pin High-Density Board to Board Connector 3 Interfaces PL-GTY High Speed Transceivers (up to 32.75Gbps) x 16
PL-GTH High Speed Transceivers (up to 16.375Gbps) x 8
80pin High-Density Board to Board Connector 4 Interfaces PL-GTH High Speed Transceivers (up to 16.375Gbps) x 8
Software Features Multi OS Support: Linux, Ubuntu, VxWorks, PYNQ, Baremetal
Security: Secure boot, TPM, watchdog, multiboot
Docker & QEMU support
Dynamic FPGA configuration
Flexible boot options
BIST, 100G & video support
General Features Power Input: 5V through B2B Connector2
Form Factor: 75mm x 110mm (OREN+)
Operating Temperature: -40°C to +85°C (Industrial
Environment Specification: REACH & RoHS3 Compliant
Compliance: CE*

*Under Progress
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  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • 10G Ethernet through SFP+ Connector
  • 12G SDI Video IN through HD BNC Connector
  • 12G SDI Video OUT through HD BNC Connector
  • 4K HDMI 2.0 IN through HDMI Connector
  • 4K HDMI 2.0 OUT through HDMI Connector
  • FMC High Pin Count (HPC) Connector
  • FMC+ High Pin Count (HPC) Connector
  • DP 1.2a Display Port Connector
  • PCIe Gen2 x4 & M.2 SATA 3.1 Connector
  • USB 3.0 OTG through Type-C Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through Micro AB Connector
  • Standard SD & Dual PMOD Connector
  • CAN Header & 20 Pin Header (for PS IOs)
  • Debug UART through USB Micro AB Connector x 1
  • Operating Temperature: -20°C to +70°C
  • Form Factor: 140mm x 170mm

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For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for ZU19/17/11EG Zynq UltraScale+ MPSoC System on Module.

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Product Design Process

Our design process transforms your vision into reality with innovation, quality, and collaboration.

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Certification & Qualification

Ensuring Compliance, Quality, and Trust Through Certification & Qualification.

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Product Lifecycle Management

Ensuring Longevity, Reliability, and Seamless Product Evolution.

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Mechanical Services

Precision Engineering for Reliable, High-Performance Mechanical Solutions.

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FAQs

An MPSoC SoM provides a proven and reliable design with optimized signal integrity, DDR tuning, and power sequencing. It reduces development cost and risk while helping accelerate time to market.

Yes. MPSoC SOMs are designed to scale across different performance levels, allowing developers to choose devices within the Zynq UltraScale+ MPSoC family (from ZU1 to ZU19) based on their application needs. This makes it easier to upgrade or adapt designs without major hardware changes.
For long-term use, SoMs from iWave are supported throughout their lifecycle, ensuring availability, reliability, and ongoing support. This helps avoid supply chain issues and keeps production stable.

  • Heterogeneous Compute in One Chip
  • Real-Time High Performance on the Same Platform
  • High-Speed Connectivity & Deterministic I/O
  • Lower System Cost & Power Consumption
  • Flexibility & Future-Proofing Through Programmable Logic
  • Scalable for Multiple Use Cases

Yes. With scalable MIPI CSI-2 support, MPSoC SOMs can handle multiple cameras, making them suitable for vision and imaging systems.

MPSoC SOMs support a wide range of high-speed interfaces, including:

  • PCIe, USB, and Ethernet
  • QSPI, eMMC, SRAM, and EEPROM
  • LVDS for high-speed data transfer
  • MIPI CSI-2 for camera and vision applications
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