Documents
Documents
Design Support
Application Notes
| Features | Details |
|---|---|
| SoC | ZU19/ZU17/ZU11 EG Processing System (PS)
Programming Logic (PL)
|
| Memory | 64bit, 4GB DDR4 RAM for PS with ECC (Expandable up to 8GB) 64bit, Dual 4GB DDR4 RAM for PL (Expandable up to 16GB) |
| Storage | 8GB eMMC Flash (Expandable up to 128GB) |
| On Board Interfaces | Gigabit Ethernet PHY Transceiver USB2.0 PHY Transceiver JTAG Header Fan Header |
| 240pin High-Speed Board to Board Connector 1 Interfaces | From PS Block
From PL Block
|
| 240pin High-Speed Board to Board Connector 2 Interfaces | From PS Block
From PL Block
|
| 240pin High-Density Board to Board Connector 3 Interfaces | PL-GTY High Speed Transceivers (up to 32.75Gbps) x 16 PL-GTH High Speed Transceivers (up to 16.375Gbps) x 8 |
| 80pin High-Density Board to Board Connector 4 Interfaces | PL-GTH High Speed Transceivers (up to 16.375Gbps) x 8 |
| Software Features | Multi OS Support: Linux, Ubuntu, VxWorks, PYNQ, Baremetal Security: Secure boot, TPM, watchdog, multiboot Docker & QEMU support Dynamic FPGA configuration Flexible boot options BIST, 100G & video support |
| General Features | Power Input: 5V through B2B Connector2 Form Factor: 75mm x 110mm (OREN+) Operating Temperature: -40°C to +85°C (Industrial Environment Specification: REACH & RoHS3 Compliant Compliance: CE* |
*Under Progress

- 100G Ethernet though QSFP28/QSFP+ Connector
- 112G FireFly Connector
- 10G Ethernet through SFP+ Connector
- 12G SDI Video IN through HD BNC Connector
- 12G SDI Video OUT through HD BNC Connector
- 4K HDMI 2.0 IN through HDMI Connector
- 4K HDMI 2.0 OUT through HDMI Connector
- FMC High Pin Count (HPC) Connector
- FMC+ High Pin Count (HPC) Connector
- DP 1.2a Display Port Connector
- PCIe Gen2 x4 & M.2 SATA 3.1 Connector
- USB 3.0 OTG through Type-C Connector
- Dual Gigabit Ethernet through RJ45MagJack
- USB2.0 OTG through Micro AB Connector
- Standard SD & Dual PMOD Connector
- CAN Header & 20 Pin Header (for PS IOs)
- Debug UART through USB Micro AB Connector x 1
- Operating Temperature: -20°C to +70°C
- Form Factor: 140mm x 170mm


For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for ZU19/17/11EG Zynq UltraScale+ MPSoC System on Module.




FAQs
An MPSoC SoM provides a proven and reliable design with optimized signal integrity, DDR tuning, and power sequencing. It reduces development cost and risk while helping accelerate time to market.
Yes. MPSoC SOMs are designed to scale across different performance levels, allowing developers to choose devices within the Zynq UltraScale+ MPSoC family (from ZU1 to ZU19) based on their application needs. This makes it easier to upgrade or adapt designs without major hardware changes.
For long-term use, SoMs from iWave are supported throughout their lifecycle, ensuring availability, reliability, and ongoing support. This helps avoid supply chain issues and keeps production stable.
- Heterogeneous Compute in One Chip
- Real-Time High Performance on the Same Platform
- High-Speed Connectivity & Deterministic I/O
- Lower System Cost & Power Consumption
- Flexibility & Future-Proofing Through Programmable Logic
- Scalable for Multiple Use Cases
Yes. With scalable MIPI CSI-2 support, MPSoC SOMs can handle multiple cameras, making them suitable for vision and imaging systems.
MPSoC SOMs support a wide range of high-speed interfaces, including:
- PCIe, USB, and Ethernet
- QSPI, eMMC, SRAM, and EEPROM
- LVDS for high-speed data transfer
- MIPI CSI-2 for camera and vision applications