Agilex™ 9 R17B Direct RF
System on Module

iG-G67M®

  • Agilex™ 9 SoC FPGA (AGRW014) in R17B package
  • Up to 1,437,240 Logic elements
  • 16 x FGT Transceivers up to 58Gbps PAM4
  • 4× ADC and 4× DAC channels with sampling rates up to 64Gsps
  • Quad-core 64-bit ARM® Cortex®-A53 up to 1.4GHz
  • Form factor 82mm x 111mm with -40°C to +85°C (Industrial)
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Features Details
Agilex™ 9 R17B Direct RF Soc FPGA Quad-core 64-bit ARM® Cortex®-A53 up to 1.4GHz
Up to 1,437,240 Logic elements
16 x FGT Transceivers up to 58Gbps PAM4
ADC x 4 & DAC x 4 ; Sampling rate up to 64Gsps
Memory 8GB DDR4 with ECC for HPS (64bit + 8bit)
8GB DDR4 with ECC for FPGA (64bit + 8bit)
Storage HPS 8bit eMMC (32GB Upgradable)
SDM QSPI Flash (1Gb Upgradable)
EEPROM (2Kb Upgradable)
On SOM Features Gigabit Ethernet PHY x 1
USB2.0 OTG through On SOM PHY x 1
On Board Clock Generators
FAN Header
Board to Board Connector Interfaces Board to Board Connector 1

  • FPGA IO’s (55LVDS/110SE)

Board to Board connector 2

  • RGMII Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG X 1 Port (through On -SOM USB PHY)
  • I2C Interface x 1
  • Debug UART x1
  • JTAG Interface x 1
  • General Purpose Transceivers x 16 (up to 58Gbps – PAM4)
  • H2F I2C x 1
RF Connector Interfaces ADC x 4 (Up to 64 GSPS)
DAC x 4 (Up to 64 GSPS)
General Features
  • Power Input: 12V through B2B Connector 2
  • Form Factor: 82mm x 111mm
  • Operating System: Linux
  • Operating Temperature: -40°C to +85°C (Industrial)
  • Environment Specification: REACH & RoHS3 Compliant

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RF-ADC/DAC Customization

Tailor resolution, sampling rates, and channel configurations to match your signal processing and bandwidth needs.

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Interface Integration

Optimize JESD204B/C, high-speed serial links, and RF front-end connections for seamless system-level integration.

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Rugged & Military-Grade Designs

Develop 3U VPX conduction-cooled systems and RF connector layouts built for extreme conditions available in both industrial and MIL grade.

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End-to-End ODM Services

From carrier + SoM integration for SDR, EW, and radar to schematic, PCB layout, thermal, mechanical, and enclosure design, we provide complete product realization.

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FAQs

Agilex™ System on Modules provide a production-ready FPGA platform with proven signal integrity, DDR tuning, and power sequencing. They reduce development risk, shorten design cycles, and accelerate time-to-market for high-performance embedded systems.

Agilex™ FPGA system on modules are supported with a Yocto-based Linux BSP including bootloader, kernel, and root filesystem. They also support bare-metal development through the Altera HAL for Nios® V (RISC-V) processors.

Yes. Agilex™ solutions support Remote System Update (RSU) with factory and application image management, enabling secure fallback, trusted recovery, and reliable field upgrades.

  • Ultra-High-Speed Networking & Compute Scalability
  • Precision Time Synchronization & Deterministic Networking
  • RF-Optimized Clocking & Power Architecture
  • Compact, Pin-Compatible & Deployment-Ready Designs

With high-speed PCIe connectivity, dynamic FPGA reconfiguration, and robust Linux support, Agilex™ enables acceleration for AI, networking, data centers, and high-performance embedded systems.

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