Versal™ AI Edge
System on Module
iG-G57M®
- Versal™ AI Edge SoC Compatible with VE2302 / VE2202 / VE2102 / VE2002 Devices
- Up to 328K Logic Cells and 150K LUTs
- 34 AI Engine-ML Tiles with 68Mb Shared AI Memory
- 8 GTYP High-Speed Transceivers up to 32Gbps
- Form factor 50mm × 60mm (REN) with -40°C to +85°C operation
Documents
| Features | Details |
|---|---|
| SoC/FPGA | VersalTMAI Edge SoC with SFVA784 package Compatible with VE2302, VE2202, VE2102 and VE2002 devices Dual-core Arm Cortex-A72 @1.65GHz Dual-core Arm Cortex-R5F @800MHz Up to 328K Logic cells and 150K LUTs 34 AIE-ML Tiles with 68Mb shared AIE-ML Memory |
| Memory | 64bit 4GB LPDDR4 (Expandable) 2Kb EEPROM |
| Storage | 16GB eMMC Flash (Expandable up to 128GB) 256MB QSPI Flash |
| Board to Board Connector Interfaces | From PL Block
From PS Block
|
| Other on SoM Features | 10/100/1000 Ethernet PHY USB Transceiver PHY 6-bit Clock Synthesizer and oscillators FAN Header |
| Software Features | Yocto / PetaLinux BSP with Vivado support PL, AIE & DMA Linux driver support Vitis AI toolchain for AIE/AIE-ML Pre-validated AI vision examples Bare-metal low-latency support Vitis AI runtime for AI deployment |
| General Features |
|
- FMC+ High Serial Pin Count (HSPC) Connector
- 4K HDMI 2.0 IN and OUT through HDMI Connector
- 12G SDI Video IN and OUT through HD BNC Connector
- Dual Gigabit Ethernet through RJ45MagJack
- USB Type-C for JTAG and PS Debug port
- USB 2.0 Interface through USB Type C Connector
- Micro SD
- PMOD Connector
- 60 Pin GPIO Header (For PS IOs)
- Operating Temperature: -20°C to +70°C
- Form Factor: 120mm x 120mm
Thermal design is a crucial factor for highly integrated System on Modules. iWave offers Heat Sink solutions for VersalTM AI Edge -based SoMs to ensure optimal thermal management.
FAQs
The AMD Versal™ Adaptive SoC is a next-generation adaptive computing platform that combines CPUs, programmable logic (FPGA), AI engines, DSP engines, and high-bandwidth networking on a single device.
Unlike traditional SoCs or FPGAs, Versal™ devices integrate multiple compute engines connected through a high-speed Network-on-Chip (NoC). This architecture allows developers to run AI, signal processing, and embedded applications efficiently in a single platform.
Yes. Versal™ AI Edge devices integrate AI engines and programmable logic to accelerate machine learning inference, vision processing, and real-time analytics. This makes them ideal for edge AI applications where low latency and high performance are required.
Versal™ SoM platforms support multiple high-speed interfaces including PCIe Gen4 and Gen5, Ethernet connectivity, and multi-gigabit transceivers that can reach speeds up to 112 Gbps depending on the device family.
Yes. With support for high-speed transceivers, PCIe Gen5, and MAC interfaces up to 600G, Versal™ SOM platforms are well suited for networking, data processing, and communication infrastructure applications.
Versal™ devices are more advanced than traditional FPGAs because they combine multiple processing engines in a single platform. They integrate CPUs, programmable logic, AI engines, and DSP blocks to handle different types of workloads efficiently.
Key benefits include:
- Heterogeneous compute architecture for flexible processing
- Software-programmable acceleration for faster development
- High-bandwidth and deterministic data movement
- Integrated high-speed transceivers for multi-gigabit connectivity
- Scalable platform for AI, networking, and embedded applications
Buy now
| Description | Stock | Order link |
|---|---|---|
| Versal VE2302 System on Module | 19 | Digikey |
| Versal VE2302 Development Kit | 6 | Digikey |
| Versal VM1102 System on Module | 20 | Digikey |
| Versal VM1102 Development Kit | 5 | Digikey |
| Versal VE2302 System on Module | 3 | Mouser |
| Versal VE2302 Development Kit | 11 | Mouser |
| Versal VM1102 System on Module | Backorder | Mouser |
| Versal VM1102 Development Kit | Backorder | Mouser |
