Zynq™ UltraScale+™ ZU7/ZU5/ZU4 MPSoC System on Module

iG-G30M®

  • Zynq™ UltraScale+™ MPSoC Family Compatible with Zynq UltraScale+ ZU7/5/4 CG/EG/EV Devices
  • Up to 504K Logic Cells & 230K LUTs
  • 4GB DDR4 with ECC for PS, 1GB DDR4 for PL
  • 8GB eMMC Flash
  • 4 PS GTR Transceivers & 16 GTH Transceivers
  • 2 x 240pin High Speed Connectors with 142 user IOs
CONTACT SALES
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Documents

Features Details
ZU7/ZU5/ZU4 – ZynqTM Ultrascale+TM MPSoC Processing System (PS)

    • Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz
    • 264/H.265 Video Encoder/Decoder (VCU)
    • Arm Mali-400MP2 GPU @677MHz

Programming Logic (PL)

    • Up to 504K Logic cells & 230K LUTs
    • PL GTH High Speed Transceivers x 16 @16.375 Gbps
RAM Memory PS: 64bit, 4GB DDR4 RAM with ECC (Expandable up to 8GB)
PL/FPGA: 16bit, 1GB DDR4 RAM (Expandable up to 2GB)
On Board Flash 8GB eMMC Flash for boot & storage (expandable up to 128GB)
Other Interfaces Gigabit Ethernet PHY Transceiver
USB2.0 PHY Transceiver
240pin High-Speed Board to Board Connector 1 Interfaces From PS Block

    • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
    • GEM3 RGMII Interface or ULPI Interface x 1
    • CAN interface x 2

From PL Block

    • High Speed GTH Transceiver Lanes x 12 (Up to 16.375Gbps)
    • HD Bank IOs – Up to 46 Single Ended IO’s
    • ADC Input pins- Up to 20 Single Ended IOs from HD Banks
240pin High-Speed Board to Board Connector 2 Interfaces From PS Block

    • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
    • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
    • USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
    • SD (4bit) x 1
    • Debug UART & Data UART x 1
    • SPI x 1
    • I2C x 2 Port
    • JTAG x 1

From PL Block

    • High Speed GTH Transceiver Lanes x 4 (Up to 16.375Gbps)
    • HP Bank IOs – 48 LVDS/96 Single Ended IO’s
    • ADC Input pins – Up to 32 Differential/Single Ended from HP Banks
Software Features
  • Multi OS Support: Linux, Ubuntu, VxWorks, PYNQ, Baremetal
  • Security: Secure boot, TPM, watchdog, multiboot
  • Docker & QEMU support
  • Dynamic FPGA configuration
  • Flexible boot options
  • BIST, 100G & video support
General Features Power Input: 5V through B2B Connector2
Form Factor: 95mm X 75mm(OREN)
Operating Temperature: -40°C to +85°C (Industrial)
Environment Specification: REACH & RoHS3 Compliant
Compliance: CE*

*Under Progress
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  • 10G Ethernet through SFP+ Connector
  • 3G SDI Video IN through HD BNC Connector
  • 3G SDI Video OUT through HD BNC Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP1.2a Display Port Connector
  • PCIe Gen2 x4 Connector
  • M.2 SATA 3.1 Connector
  • USB 3.0 OTG through Type-C Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB/Type-C Connector
  • Standard SD Connector
  • CAN Header
  • JTAG Header
  • Debug MicroAB connector
  • Dual PMOD Connector
  • RTC Coin Cell Holder
  • Operating Temperature: -20°C to +70°C
  • Form Factor: 130mm x 140mm

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For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for ZU7/ZU5/ZU4 MPSoC SoM.

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Product Design Process

Our design process transforms your vision into reality with innovation, quality, and collaboration.

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Certification & Qualification

Ensuring Compliance, Quality, and Trust Through Certification & Qualification.

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Product Lifecycle Management

Ensuring Longevity, Reliability, and Seamless Product Evolution.

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Mechanical Services

Precision Engineering for Reliable, High-Performance Mechanical Solutions.

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FAQs

An MPSoC SoM provides a proven and reliable design with optimized signal integrity, DDR tuning, and power sequencing. It reduces development cost and risk while helping accelerate time to market.

Yes. MPSoC SOMs are designed to scale across different performance levels, allowing developers to choose devices within the Zynq UltraScale+ MPSoC family (from ZU1 to ZU19) based on their application needs. This makes it easier to upgrade or adapt designs without major hardware changes.
For long-term use, SoMs from iWave are supported throughout their lifecycle, ensuring availability, reliability, and ongoing support. This helps avoid supply chain issues and keeps production stable.

  • Heterogeneous Compute in One Chip
  • Real-Time High Performance on the Same Platform
  • High-Speed Connectivity & Deterministic I/O
  • Lower System Cost & Power Consumption
  • Flexibility & Future-Proofing Through Programmable Logic
  • Scalable for Multiple Use Cases

Yes. With scalable MIPI CSI-2 support, MPSoC SOMs can handle multiple cameras, making them suitable for vision and imaging systems.

MPSoC SOMs support a wide range of high-speed interfaces, including:

  • PCIe, USB, and Ethernet
  • QSPI, eMMC, SRAM, and EEPROM
  • LVDS for high-speed data transfer
  • MIPI CSI-2 for camera and vision applications
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