Documents
Documents
Design Support
Application Notes
| Features | Details |
|---|---|
| On Module Feature | CPU
Memory & Storage
|
| Edge Connector Features | Gigabit Ethernet x 1 (mini optionally support x 2) PCIe 2.0 x 1 (Not supported in Nano) USB 2.0 OTG x 2 (Nano supports x 1) SD 3.0 x 1 4 lane MIPI DSI x 1 4 lane MIPI CSI x 1 SAI x 1 (Not supported in Nano) eCSPI x 3 I2S x 1 I2C x 2 UART x 4 (One is optional) SPDIF x 1 PWM x 2 JTAG x 1 GPIOs |
| OS Support | Linux 5.15.52 Android Pie 11.0.0 Ubuntu 22.04 Buildroot 2021.02.8 LTS |
| General Features | Power Input: 3.3V, 4A through SODIMM Edge Connector Form Factor: 67.6mm x 37mm Operating Temperature: -40°C to +85°C (Industrial) 0°C to +70°C (Commercial) Environment Specification: REACH & RoHS3 Compliant |
Note: Optional features are not supported in default configuration

- Gigabit Ethernet Jack x1 (mini optionally support x2)
- USB 2.0 Host Type-A x2 (Not supported in Nano)
- USB 2.0 OTG Type-micro-AB x1
- Mini PCIe slot x1 (Not supported in Nano)
- Micro SD x1
- 5.5” 1080p MIPI DSI display with Capacitive Touch
- MIPI CSI Camera Connector
- Audio In/Out Jack through I2S Codec x1
- Full Function UART – 1 Port
- GPIO Header x1 & JTAG Header x1
- RTC with backup battery
- Debug UART through Micro USB Port



Thermal design design plays a crucial role in highly integrated System on Modules. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 8M Mini or i.MX 8M Nano SODIMM SOM.
LVDS & HDMI DAUGHTER BOARD
- MIPI to HDMI & LVDS conversion
- 7-inch LVDS Display with Cap.Touch
- HDMI TX Connector



