Documents
| Features | Details |
|---|---|
| CPU | Dual core Arm Cortex-A7 32-bit processor |
| Power | DA9062 PMIC |
| Memory | 2GB DDR4 with ECC (16-bit + 4-bit) 16GB eMMC expandable up to 128GB 256MB NOR Flash 32Mbit MRAM 512 Kbit SRAM (Optional) |
| Other On-SOM Features | Gigabit Ethernet PHY x 2 2 x USB 3.0 Host 4 x USB 2.0 1 x USB 2.0 OTG (optional) TPM 2.0 Module (optional) Debug UART Header JTAG Header |
| SMARC PCB Edge Interfaces | Gigabit Ethernet x 2 (through On-SOM Gigabit Ethernet PHY) One PCIe x 4 / Two PCIe x 2/ One PCIE x2 & SERDES x 2 SATA x 1 (Optional) USB 3.0 Host x 4 Ports (through on SOM USB Hub) SD (4-bit) x 1 (Optional) I2C x 2 SPI x 1 QSPI x 1 SAI x 2 Flex CAN x 2 SMARC GPIO`s UART x 1 UART with RTS & CTS x 1 Debug UART |
| General Features | Power Input: 5V input through SMARC Edge Connector Form Factor: 82mm x 50mm Operating Temperature: -40°C to +85°C (Industrial) BSP Support: Linux 6.1.1 Environment Specification: RoHS & REACH Compliant |

- Gigabit Ethernet Jack x 2
- PCIe x 4 / PCIe x 2 & M.2 PCIe slot / PCIe x 2 & M.2 SATA slot
- USB 3.0 Type-A x 2
- USB 2.0 Host Type-A x 2
- Standard SD x1
- Audio In & Out Jack through I2S Codec x 2
- Full Function UART – 1 Port
- RTC with a backup battery
- CAN Header x 2
- RS232 Header x 1
- USB 2.0 OTG Type-micro-AB x1(Optional)
- Debug UART through Micro USB Port (Optional)


Thermal design For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for Layerscape LS1021A SMARC SOM.



