Documents
| Features | Details |
|---|---|
| SoC | Versal™ AI Edge/Prime Compatible with VE2302/2202/2102/2002/VM1102 Devices Dual Arm Cortex- A72 and Dual Arm Cortex R5F Up to 328K Logic cells and 150K LUTs |
| Memory & Storage | 64bit, 4GB LPDDR4 from PS (Upgradable) 256MB QSPI Flash and 16GB eMMC Flash (Upgradable) |
| IPMC | Arm® 32-bit Cortex®-M0+ CPU up to 80 MHz On chip 64KB of flash and 4KB of SRAM One 12-bit 1.68-MSPS analog-to-digital converter (ADC) |
| VPX Front Panel features | Gigabit Ethernet Header USB3.0 Type-C 3-pin Debug UART Header Display Port ADC x4 & DAC x4; Sampling rate up to 1.6GSPS |
| VPX On board features | On Board Clock Generators Temperature Sensor x1 Elapse Counter x1 EEPROM x1 |
| 3U VPX Backplane: Connector – P0 |
Utility Plane
|
| 3U VPX Backplane: Connector – P1A +P1B |
Data Switch Port-01
System Control Signals (Maskable Reset, SysCON, GDiscrete) |
| 3U VPX Backplane: Connector – P2A |
Control Plane Port
Control Plane Port
Maintenance Port MP02 |
| 3U VPX Backplane: Aperture Pattern J – P2B |
MT Ferrule Module – MM12F – 12 Fibre ports |
| Profile Specification | Profile: SLT3-SWH-4F1U7U1J-14.8.7-1 Module Profile as per AMPS:
|
| General Specification | Slot Pitch: 1 inch Conduction Cooled BSP Support: Linux Environment Specification: RoHS & REACH Compliant |


Thermal design is a crucial factor for highly integrated System on Modules. iWave offers Heat Sink solutions for VersalTM AI Edge -based SoMs to ensure optimal thermal management.



