i.MX 8M Plus SMARC
System on Module
iG-G40M®
- i.MX 8M Plus Q/QL/D with Arm Cortex-A53 @1.8GHz & Arm Cortex-M7 @800MHz
- NPU with up to 2.3 TOPS Neural Network performance
- 2GB LPDDR4 Expandable up to 8GB
- 16GB eMMC Flash Expandable up to 128GB, Micro SD Slot
- Wi-Fi 5 and Bluetooth 5.0 Connectivity
- Excels in ML vision, edge intelligence & advanced multimedia applications.
Documents
Documents
Design Support
| Features | Details |
|---|---|
| On Module Feature | CPU
Memory & Storage
Other
|
| Edge Connector Features | Gigabit Ethernet x 2 (TSN support on one port) PCIe 3.0 x 1 USB 2.0 Host x 4 USB 3.0 Host x 1 (Not including 2.0 lines) USB 3.0 OTG x 1 SD 3.0 x 1 HDMI 2.0a TX x 1 LVDS0/MIPI DSI x 1 Channel (1 x 4Lane) LVDS1 x 1 Channel (1 x 4Lane) 2 lane MIPI CSI0 x 1 4 lane MIPI CSI1 x 1 I2C x 4(Power Management I2C is optional) CAN FD x 2 SPI x 2 I2S x 2 UART x 4(One is optional) PWM x 2 SMARC GPIOs |
| Camera Connector Features (Optional) | 4 lane MIPI CSI0 x 1 (Optional) I2C x 1 (Optional) GPIOs (Optional) |
| OS Support | Linux 6.6.23 Android 11 Ubuntu 22.04 Debian 12 |
| General Features | Power Input: 5V, 2.5A through SMARC EDGE Connector Form Factor: 82mm x 50mm Operating Temperature: -40°C to +85°C Environment Specification: REACH & RoHS3 Compliant |
- Gigabit Ethernet Jack x 2
- PCIe x 1 & M.2 KEY B PCIe
- USB 3.0 Type-A & Type-C OTG
- USB 2.0 Host Type-A x 2
- USB 2.0 OTG Type-micro-AB x 1(Optional)
- Standard SD x 1, HDMI TX x 1
- MIPI DSI & 20pin LVDS Connector
- 40 Pin LVDS Connector
- MIPI CSI Camera Connector
- Audio In & Out Jack through I2S Codec x 2
- Full Function UART – 1 Port
- RTC with a backup battery
- CAN Header x 2
- Debug UART through Micro USB Port
Thermal designis a critical aspect for any highly integrated OSM module. iWave offers Heat Sink and Heat Spreader Solution for i.MX 8M Plus SMARC SOM.
Enclosure is essential for any Devkit, and iWave offers rugged aluminum and metal sheet options that protect the device while allowing full access to all major ports.
