i.MX 93 SODIMM
System on Module

iG-G50M®

  • i.MX 93 CPU with Dual 64-bit Arm Cortex-A55
  • NPU with up to 0.5 TOPS Neural Network Performance
  • 2GB LPDDR4X Memory
  • 16GB eMMC Flash expandable up to 128GB
  • Wi-Fi 6, Bluetooth 5.3 Connectivity
  • Modular & Compact SODIMM form factor
CONTACT SALES
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Documents

Features Details
CPU i.MX 9352: 2 x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2 x Ethernet, 2 x USB 2.0, 7 x I2S TDM
i.MX 9351: 1 x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2 x Ethernet, 2 x USB 2.0, 7 x I2S TDM
i.MX 9332: 2 x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2 x Ethernet, 2 x USB 2.0, 7 x I2S TDM
i.MX 9331: 1x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2 x Ethernet, 2 x USB 2.0, 7 x I2S TDM
Memory & Storage LPDDR4X – 2GB
eMMC Flash – 16GB (Expandable)
Other On-SOM Features IEEE 802.11a/b/g/n/ac/ax + Bluetooth 5.3 + IEEE802.15.4 (Optional)
Gigabit Ethernet PHY Transceiver x 1
EEPROM
RTC Controller
TPM module (Optional)
SODIMM PCB Edge Interfaces Gigabit Ethernet x 1
LVDS x 1
MIPI DSI (4 Lane) x 1
MIPI CSI (2 Lane) x 1
SD (4bit) x 1
USB 2.0 OTG x 1
USB 2.0 Host x 1
SAI (Audio Interface) x 1
Debug UART x 1
Data UART (without CTS & RTS) x 1
PWM x 2
CAN x 2
ADC x 4
JTAG
GPIOs
I2C
SPI
RGB 24 bit (Optional)
QOS RGMII signals (Optional)
Tamper x 2(Optional)
CLKIN x 2(Optional)
OS Support Linux 6.1.22
General Features Power Input: 3.3V, 2A Input from SODIMM Edge Connector
Form Factor: 67.6mm x 37mm
Operating Temperature: -40°C to +85°C (Industrial Grade)
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  • Debug UART through USB Micro AB Connector
  • DATA UART x 1 Port through Header
  • 10/100/1000 Mbps Ethernet through RJ45-MagJack-1
  • USB 2.0 OTG as a device x 1 Port through Micro AB Connector
  • USB 2.0 Host x 2 Ports through USB Type-A Connector
  • SD x 1 Port through Micro SD Connector
  • CAN Module
  • I2S Audio Codec with 3.5mm Audio IN/OUT jack

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