Documents
| Features | Details |
|---|---|
| CPU | i.MX 9352: 2 x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2 x Ethernet, 2 x USB 2.0, 7 x I2S TDM i.MX 9351: 1 x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2 x Ethernet, 2 x USB 2.0, 7 x I2S TDM i.MX 9332: 2 x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2 x Ethernet, 2 x USB 2.0, 7 x I2S TDM i.MX 9331: 1x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2 x Ethernet, 2 x USB 2.0, 7 x I2S TDM |
| Memory & Storage | LPDDR4X – 2GB eMMC Flash – 16GB (Expandable) |
| Other On-SOM Features | IEEE 802.11a/b/g/n/ac/ax + Bluetooth 5.3 + IEEE802.15.4 (Optional) Gigabit Ethernet PHY Transceiver x 1 EEPROM RTC Controller TPM module (Optional) |
| SODIMM PCB Edge Interfaces | Gigabit Ethernet x 1 LVDS x 1 MIPI DSI (4 Lane) x 1 MIPI CSI (2 Lane) x 1 SD (4bit) x 1 USB 2.0 OTG x 1 USB 2.0 Host x 1 SAI (Audio Interface) x 1 Debug UART x 1 Data UART (without CTS & RTS) x 1 PWM x 2 CAN x 2 ADC x 4 JTAG GPIOs I2C SPI RGB 24 bit (Optional) QOS RGMII signals (Optional) Tamper x 2(Optional) CLKIN x 2(Optional) |
| OS Support | Linux 6.1.22 |
| General Features | Power Input: 3.3V, 2A Input from SODIMM Edge Connector Form Factor: 67.6mm x 37mm Operating Temperature: -40°C to +85°C (Industrial Grade) |

- Debug UART through USB Micro AB Connector
- DATA UART x 1 Port through Header
- 10/100/1000 Mbps Ethernet through RJ45-MagJack-1
- USB 2.0 OTG as a device x 1 Port through Micro AB Connector
- USB 2.0 Host x 2 Ports through USB Type-A Connector
- SD x 1 Port through Micro SD Connector
- CAN Module
- I2S Audio Codec with 3.5mm Audio IN/OUT jack


Thermal design plays a crucial role in highly integrated System on Modules. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 93 SODIMM SOM



