Versal™ AI Edge Gen2
System on Module
iG-G77M®
- Versal™ AI Edge Gen2 SoC System on Module (SSVA2112 Package)
- Supports 2VE3858, 2VE3804, 2VE3558, and 2VE3504 devices
- Integrated AIE-ML v2 for real-time AI processing
- High-speed PCIe Gen5 connectivity
- Up to 1188K logic cells and 543K LUTs for complex FPGA designs
- 24 GTYP transceivers supporting data rates up to 32 Gbps
- Up to 86 LVDS / 172 SE FPGA I/Os (X5IO Bank) plus 44 SE I/Os (HDIO Bank)
Documents
| Features | Details |
|---|---|
| SoC | Versal AI Edge Gen2 SoC with SSVA2112 package Compatible with 2VE3858, 2VE3804, 2VE3558 and 2VE3504 Devices 8x Arm Cortex- A78AE (up to 2.2GHz) and 10x Cortex R52(up to 1.05GHz) 4-core Arm Mali-G78AE Graphic Processing Unit(GPU) (up to 1.05GHz) Supports Video Codec Unit(VCU) and Image Signal Processor(ISP) Supports AIE-ML v2 Up to 1188K Logic cells and 543K LUTs |
| Memory | Four 32bit, 4GB LPDDR5x 2Kbit EEPROM |
| Storage | 256MB OSPI flash 32GB eMMC Flash 64GB UFS flash (Optional) |
| Board to Board Connector Interfaces | From PL Block:
From PS Block:
|
| Other On SOM Features | 10/100/1000 Ethernet PHY with PTP Programmable Clock Synthesizer 768KHz crystal for RTC FAN Header |
| Software Features | Yocto / PetaLinux BSP with Vivado support PL, AIE & DMA Linux driver support Vitis AI toolchain for AIE/AIE-ML Pre-validated AI vision examples Bare-metal low-latency support Vitis AI runtime for AI deployment |
| General Features | Power Input: 5V through B2B Connector Form Factor: 70mm x 80mm (REN+) Operating Temperature: -40°C to +85°C (Industrial) Environment Specification: REACH & RoHS3 Compliant |
- FMC+ High Serial Pin Count (HSPC) Connector
- 4K HDMI 2.0 IN and OUT through HDMI Connector
- 12G SDI Video IN and OUT through HD BNC Connector
- Dual Gigabit Ethernet through RJ45MagJack
- USB Type-C for JTAG and PS Debug port
- USB 2.0 Interface through USB Type C Connector
- Micro SD
- PMOD Connector
- 60 Pin GPIO Header (For PS IOs)
- Operating Temperature: -20°C to +85°C
- Form Factor: 120mm x 120mm
For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Fan Sink solution for Versal AI Edge Gen2 SOM
FAQs
The AMD Versal™ Adaptive SoC is a next-generation adaptive computing platform that combines CPUs, programmable logic (FPGA), AI engines, DSP engines, and high-bandwidth networking on a single device.
Unlike traditional SoCs or FPGAs, Versal™ devices integrate multiple compute engines connected through a high-speed Network-on-Chip (NoC). This architecture allows developers to run AI, signal processing, and embedded applications efficiently in a single platform.
Yes. Versal™ AI Edge devices integrate AI engines and programmable logic to accelerate machine learning inference, vision processing, and real-time analytics. This makes them ideal for edge AI applications where low latency and high performance are required.
Versal™ SoM platforms support multiple high-speed interfaces including PCIe Gen4 and Gen5, Ethernet connectivity, and multi-gigabit transceivers that can reach speeds up to 112 Gbps depending on the device family.
Yes. With support for high-speed transceivers, PCIe Gen5, and MAC interfaces up to 600G, Versal™ SOM platforms are well suited for networking, data processing, and communication infrastructure applications.
Versal™ devices are more advanced than traditional FPGAs because they combine multiple processing engines in a single platform. They integrate CPUs, programmable logic, AI engines, and DSP blocks to handle different types of workloads efficiently.
Key benefits include:
- Heterogeneous compute architecture for flexible processing
- Software-programmable acceleration for faster development
- High-bandwidth and deterministic data movement
- Integrated high-speed transceivers for multi-gigabit connectivity
- Scalable platform for AI, networking, and embedded applications
