Versal™ AI Edge/Prime
3U VPX Plug-in Module (Payload Profile)
iG-G57V®
- SOSA aligned Versa™l AI Edge/Prime 3U VPX board
- Compatible with VE2302/2202/2102/2002/VM1102 Devices with SFVA784 package
- One 64-bit, 4GB LPDDR4
- Supports SOSA Aligned Payload profiles
- IPMC with Arm® 32-bit Cortex®-M0+ CPU
- ADC x4 & DAC x4 with sampling rate up to 1.6GSPS
Documents
| Features | Details |
|---|---|
| SoC | Versal™ AI Edge/Prime Compatible with VE2302/2202/2102/2002/VM1102 Devices Dual-Core Arm Cortex- A72 and Dual-Core Arm Cortex R5F Up to 328K Logic cells and 150K LUTs |
| Memory & Storage | 64bit, 4GB LPDDR4 from PS (Upgradable) 256MB QSPI Flash and 16GB eMMC Flash (Upgradable) |
| IPMC | Arm® 32-bit Cortex®-M0+ CPU up to 80 MHz On chip 512KB of flash and 128KB of SRAM Two 12-bit 4MSPS analog-to-digital converter (ADC) |
| VPX Front Panel features | Gigabit Ethernet Header USB3.0/2.0 Type-C 3-pin Debug UART Header Display Port ADC x4 & DAC x4; Sampling rate up to 1.6GSPS1 |
| VPX On board features | On Board Clock Generators Temperature Sensor x1 Elapse Counter x1 EEPROM x1 |
| 3U VPX Backplane: Connector – P0 |
Utility Plane
|
| 3U VPX Backplane: Connector – P1A +P1B |
Data Plane 1 Fat Pipe Port
System Control Signals (Maskable Reset, SysCON, GDiscrete) |
| 3U VPX Backplane: Connector – P2A |
User defined Port
|
| 3U VPX Backplane: Aperture Pattern J – P2B |
1 MT Ferrule Module – MM12F (12 Fibre ports):
10 NanoRF contacts:
|
| Profile Specification | Profile: SLT3-PAY-1F1U1S1S1U1U4F1J-14.6.13-4 Module Profile as per AMPS:
|
| General Specification | Slot Pitch: 1 inch Conduction Cooled BSP Support: Linux Form Factor: 160mm X 100mm Environment Specification: RoHS & REACH Compliant |
1ADC and DAC ports will be available in either via Aperture J or in front panel
Thermal design is a crucial factor for highly integrated System on Modules. iWave supports VITA 48.2 compliant 3U Conduction Cooled Heat Spreader
