TI AM62Ax OSM-LF System on Module
iG-G55M®
- AM62Ax with 64-Bit Quad Arm Cortex-A53
- Dual core ARM Cortex-R5F Subsystem
- 2GB LPDDR4 Expandable up to 8GB and 16GB eMMC Flash
- C7xV-256 Deep Learning Accelerator (2 TOPS)
- IEEE 802.11 a/b/g/n/ac/ax Wi-Fi 6 + BT 5.3 + IEEE 802.15.4
- AEC-Q104*
Documents
Design Support
Software
| Features | Details |
|---|---|
| CPU | 4 x Arm Cortex-A53@1.4GHz 1 x Arm Cortex-R5F (Integrated as part of MCU Channel with FFI) @800MHz 1 x Arm Cortex-R5F (Integrated to support Device Management) @800MHz |
| Memory | 2GB LPDDR4 expandable up to 8GB 16GB eMMC Flash expandable up to 128GB 16Mb QSPI Flash |
| Other | IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4 |
| OSM BGA Features | Main Domain
MCU Domain
|
| OS Support | Linux 6.1.46 Free RTOS |
| General Features | Power Input: 5V, 2.5A through OSM BGA Operating Temperature: -40°C to +85°C (AEC-Grade 3) Form Factor: 45mm x 45mm Environment Specification: RoHS3 & REACH Compliant |
- AM62Ax with 64-Bit Quad ARM Cortex® A53 & Dual core ARM
- Cortex®-R5F Subsystem
- 2GB LPDDR4 memory and 16GB eMMC Flash
- 16Mb QSPI NOR Flash
- C7xV-256 Deep Learning Accelerator (up to 2 TOPS)
- IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4
- Gigabit Ethernet Jack x 1
- USB2.0 OTG Micro-B Conn x 1
- USB2.0 Header x 1
- Debug UART Connector x 1
- RTC Battery Connector x 1
- Expansion Connector x 3 with support for:
- RGMII, UART, SPI, CAN, PWM, I2S, I2C, JTAG & GPIOs
- Compact Form Factor of 85mm x 56mm
Thermal design For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for TI AM62Ax OSM LGA Module.
Enclosure The Enclosure is essential for a SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.
