| SoC/FPGA |
Dual-core Arm Cortex-A72 APU @1.3GHz
Dual-core Arm Cortex-R5F RPU @600MHz
Compatible with XQRVE2302 devices
Up to 329K System Logic Cells & 150.272K LUTs
34 AIE-ML Tiles with 68Mb AIE-ML Shared Memory
TID: Maximum of up to 120 krad (Si)
SEL: Up to 80 MeV.cm²/mg
SEU:
For GEO:
- SEUCRAM – 6.5×10–12Event/bit/day
- SEUBRAM – 9.4 x 10–10Event/bit/day
- SEUURAM – 1.8 x 10–10Event/bit/day
For LEO:
- SEUCRAM – 3.5 x 10–9Event/bit/day
- SEUBRAM – 1.2 x 10–7Event/bit/day
- SEUURAM – 2.9 x 10–8Event/bit/day
|
| Memory |
64-bit, 4GB DDR4 (up to 8GB)
4Mb EEPROM |
| Storage |
32GB eMMC Flash (up to 256GB)
64MB QSPI Flash (up to 128MB) |
| Board to Board Connector Interfaces |
From PL Block
- 8 GTYP Transceivers at 26.5625Gbps
- 27LVDS/54SE from XPIOs & 20SE from HDIOs
From PS Block
- Select MAP (8-bit) x1
- GEM0 10/100/1000Mbps Ethernet x1
- GEM1 RGMII x1
- SD1 (4-bit) x1
- Debug UART x1
- JTAG x1
- SPI (3CS) x1
- CAN FD x1
- PMC I2C x1
|
| Other On-SOM Features |
10/100/1000Mbps Ethernet PHY x1 |
| General Features |
- Power Input: 5V through B2B Connector
- Form Factor: REN
- BSP Support: Linux/Vivado 2024 or above
- Operating Temperature: -55°C to +125°C
- TID: 30krad (Si)
- SEL: 43MeV.cm²/mg
- SEU: 60MeV.cm²/mg
- Specification: MIL-STD-883E Group – B, D & E Compliant
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