Versal™ AI Edge XQR
System on Module

iG-G57M-SP®

  • Versal™ AI Edge XQR with SSRA784 Package
  • Compatible with XQRVE2302 devices
  • Up to 329K Logic Cells & 150K LUTs
  • 64-bit, 4GB DDR4 Memory
  • 32GB eMMC and 64MB QSPI Flash
  • 8 GTYP Transceivers at 26.5625Gbps and 27LVDS/54SE from XPIOs & 20SE from HDIOs
  • TID: 30krad (Si), SEL: 43MeV.cm²/mg, and SEU: 60MeV.cm²/mg
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Features Details
SoC/FPGA Dual-core Arm Cortex-A72 APU @1.3GHz
Dual-core Arm Cortex-R5F RPU @600MHz
Compatible with XQRVE2302 devices
Up to 329K System Logic Cells & 150.272K LUTs
34 AIE-ML Tiles with 68Mb AIE-ML Shared Memory
TID: Maximum of up to 120 krad (Si)
SEL: Up to 80 MeV.cm²/mg
SEU:
For GEO:

  • SEUCRAM – 6.5×10–12Event/bit/day
  • SEUBRAM – 9.4 x 10–10Event/bit/day
  • SEUURAM – 1.8 x 10–10Event/bit/day

For LEO:

  • SEUCRAM – 3.5 x 10–9Event/bit/day
  • SEUBRAM – 1.2 x 10–7Event/bit/day
  • SEUURAM – 2.9 x 10–8Event/bit/day
Memory 64-bit, 4GB DDR4 (up to 8GB)
4Mb EEPROM
Storage 32GB eMMC Flash (up to 256GB)
64MB QSPI Flash (up to 128MB)
Board to Board Connector Interfaces From PL Block

  • 8 GTYP Transceivers at 26.5625Gbps
  • 27LVDS/54SE from XPIOs & 20SE from HDIOs

From PS Block

  • Select MAP (8-bit) x1
  • GEM0 10/100/1000Mbps Ethernet x1
  • GEM1 RGMII x1
  • SD1 (4-bit) x1
  • Debug UART x1
  • JTAG x1
  • SPI (3CS) x1
  • CAN FD x1
  • PMC I2C x1
Other On-SOM Features 10/100/1000Mbps Ethernet PHY x1
General Features
  • Power Input: 5V through B2B Connector
  • Form Factor: REN
  • BSP Support: Linux/Vivado 2024 or above
  • Operating Temperature: -55°C to +125°C
  • TID: 30krad (Si)
  • SEL: 43MeV.cm²/mg
  • SEU: 60MeV.cm²/mg
  • Specification: MIL-STD-883E Group – B, D & E Compliant

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