RFSoC ADC DAC 3U VPX
Plug-in Module

iG-G60V

  • AMD Zynq™ Ultrascale+™ RFSoC ZU48/47/43/28/27/25DR
  • Programming Logic (PL) with up to 930K Logic cells
  • PL GTY High Speed Transceivers x 16 @ upto 28.21 Gbps
  • 8 DAC channels | 30 MHz–6 GHz | up to 9.85 GSPS
  • 8 ADC channels | 30 MHz–6 GHz | up to 5 GSPS
  • Integrated ultra low-noise programmable RF PLL
  • Integrated SyncE & PTP Network Synchronization
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Features Details
SoC Zynq™ Ultrascale+™ RFSoC ZU48/47/43/28/27/25DR

Processing System (PS)

  • Quad-core ARM Cortex-A53 MPCore Application processor (up to 1.3GHz)
  • Dual-core ARM Cortex-R5 MPCore Real Time Processor (up to 533MHz)

Programming Logic (PL)

  • Programming Logic (PL) with up to 930K Logic cells
  • PL GTY High Speed Transceivers x 16 @ upto 28.21 Gbps
RAM Memory 64bit, 8GB DDR4 RAM for PS with ECC
64bit, 8GB DDR4 RAM for PL
Flash Memory 256MB QSPI Flash for Booting
32GB eMMC Flash for Storage
2-Kbit EEPROM x2
Clock & PLL Integrated Configurable ultra low noise PLL for ADC & DAC
Fully Configurable Clock Synthesizer with SyncE and PTP support
3U VPX Backplane Features 3U VPX Connector – P0+P1A

  • Data Plane Port: DP01[3:0]
    • 40GBASE-KR4 using PL GTY Bank Transceivers
  • Data Plane 1 Ultra-Thin Pipe
    • DPutp01 – GPLVDS x 2 Pairs. Optionally supports 10GBASE-KR using PL GTY Bank Transceivers.
  • Control Plane Ultra-Thin Pipe
    • CPutp01 – 1000BASE using PL Bank IOs. Optionally supports 10GBASE-KR using PL GTY Bank Transceivers.
  • Utility Plane
    • System Control Signals,System Reference Clocks, Bussed GPIO, Power Input (12V VDC, 3.3V_AUX,VBAT)

3U VPX Connector (P1B+P2A)

  • Expansion Port
    • EP [0:7] PCIe Gen3 x8 using PL GTY Bank Transceivers.
    • EP [8:15] – Supports GPLVDS using PL IOs x16 Pairs.
  • Utility Plane
    • System Control Signals
  • Maintenance Port
    • MP01 & MP02
NanoRF +MT Ferrule Hybrid Connector -(P2B ) 4 DAC channels supporting 30 MHz to 6 GHz with sampling rates up to 9.85 GSPS (Configurable).
4 ADC channels supporting 30 MHz to 6 GHz with sampling rates up to 5 GSPS (Configurable).
Multi-gigabit transceivers lanes x4 to backplane using Optical Firefly
Front Panel Features USB 3.0 through USB Type-C Connector (Optionally supports DP)
10/100/1000Mbps Ethernet through 9 Pin Header
3 Pin Debug UART Header
Micro-SD Connector
Other On Board Features PCIe Gen2 x2 through M.2 Connector
Temperature Sensor
Elapse Time Counter
Clock Synthesizer for Transceiver Reference clocks
General Specification Power Input: +12VDC and 3V3_AUX input from VPX Connector
Thermal Solution: Integrated Heat Spreader
Form Factor: 3U VPX (160mm X 100mm)
Profiles Supported:

  • Module Profile : MOD3p-PAY-1F1U1S1S1U1U4F1J-16.6.13-n
  • Slot Profile : SLT3p-PAY-1F1U1S1S1U1U4F1J-14.6.13-n
  • Also Supports other SLT3 slot profiles

Slot Pitch: 1 Inch Conduction Cooled
Operating Temperature: -40°C to +85°C
Environment Specification: REACH & RoHS Compliant

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