Documents
Design Support
| Features | Details |
|---|---|
| On Module Feature | CPU
Memory & Storage
|
| Network & Communication | Gigabit Ethernet x2 (Dual RJ45 Mag-jack Connector) USB 3.0 x2 (Dual-stack Type-A Connector) USB 2.0 OTG (micro–AB Receptacle Connector) IEEE 802.11 a/b/g/n/ac/ax Wi-Fi & BT 5.0 (ax is optional) GNSS receiver Modul -GPS/GLONASS/Galileo/BeiDou RS232 Header x 1 USB Header x 1 CAN Header x 1 TypeC OTG |
| Audio/Video Features | HDMI Output through HDMI (Type A) LVDS Display Connector x 1 3.5mm Audio IN/OUT Jack Speaker Out Header 5.5inch MIPI DSI Display 2 Lane MIPI DSI Display (Optional) MIPI CSI Camera Connector |
| Miscellaneous Interfaces | Debug UART Connector RTC Battery Connector JTAG Header M.2 Key B Connector PCIe 3.0 ×1 USB 2.0 x 1 Nano SIM Connector |
| Expansion Connector Features | 4 lane LVDS x 1 Channel UART x 1 8-bit SD (optional) SPI x 1 Port PWM x 1 CAN x 1 Port |
| OS Support | Linux 6.6.23 Android 14.2.2.0 Ubuntu 22.04 Debian 12 |
| General Features | Power Input: 7V to 24V (By default, 12V) Form Factor: 100mm x 72mm Operating Temperature: -40°C to +85°C Environment Specification: REACH & RoHS3 Compliant |

- i.MX 8M Plus Q/QL/D SoC with 64-bit ARMv8-A Architecture
- NPU with up to 2.3 TOP/s Neural Network performance
- IEEE 802.11a/b/g/n/ac Wi-Fi & Bluetooth 5.0.
- Excels in ML vision, edge intelligence & advanced multimedia applications.
- Dual or Quad-core ARM Cortex-A53 up to 1.8GHz & M7 at 800MHz
- 10+ years of Product Longevity Program
- OSM v1.0 Size L LGA Module



Thermal design is a critical aspect for any highly integrated Single Board Computer. iWave offers Heat Sink and Fan Sink Solution for i.MX 8M Plus Pico ITX SBC.
Enclosure is essential for any SBC, and iWave offers rugged aluminum and metal sheet options that protect the device while allowing full access to all major ports.



