Zynq™ UltraScale+™ XQ MPSoC 19/11EG System on Module – MIL Grade

iG-G35M-ML®

  • Zynq™ UltraScale+™ XQ MPSoC family with FFRC1760 package
  • Compatible with ZU19/ZU11 EG devices
  • 4GB DDR4 RAM for PS with ECC & Dual 4GB DDR4 RAM for PL
  • 32GB eMMC Flash (Expandable up to 128GB) & 256MB QSPI Flash
  • Up to 1143K Logic cells & 522K LUTs
  • 16 GTY Transceivers, 32 GTH Transceivers, 4 GTR Transceivers and 174 IOs
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Features Details
SoC ZU19/ZU11 EG
Processing System (PS)

  • Quad/Dual Arm Cortex-A53 at 1.2GHz, Dual Cortex-R5 at 500MHz
  • Arm Mali-400MP2 GPU @600MHz

Programming Logic (PL)

  • Up to 1143K Logic cells and 522K LUTs
  • PL GTY High Speed Transceivers x16 at 25.785Gbps
  • PL GTH High Speed Transceivers x32 at 12.5Gbps
Memory 64bit, 4GB DDR4 RAM for PS with ECC
64bit, Dual 4GB DDR4 RAM for PL
Storage 32GB eMMC Flash (Expandable up to 128GB)
256MB QSPI
2Kb EEPROM
240pin High-Speed Board to Board Connector 1 Interfaces From PS Block

  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • GEM3 RGMII Interface or ULPI Interface x 1
  • CAN Interface x 2

From PL Block

  • High Speed GTH Transceiver Lanes x 12 (Up to 12.5Gbps)
  • HD Bank IOs – Up to 46 Single Ended IO’s
  • ADC Input pins- Up to 32 Single Ended IOs from HD Banks
240pin High-Speed Board to Board Connector 2 Interfaces From PS Block

  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • SD (4bit) x 1
  • Debug UART and Data UART x 1
  • SPI x 1(Optional)
  • I2C x 2 Port
  • JTAG x 1

From PL Block

  • High Speed GTH Transceiver Lanes x 4 (Up to 12.5Gbps)
  • HP Bank IOs – Up to 48 LVDS/96 Single Ended IO’s
  • ADC Input pins – Up to 16 Differential/Single Ended HP Banks
240pin High-Density Board to Board Connector 3 Interfaces PL-GTY High Speed Transceivers (up to 25.785Gbps) x 16
PL-GTH High Speed Transceivers (up to 12.5Gbps) x 8
80pin High-Density Board to Board Connector 4 Interfaces PL-GTH High Speed Transceivers (up to 12.5Gbps) x 8
General Features Power Input: 5V through B2B Connector2
Form Factor: 75mm x 110mm (OREN+)
BSP Support: Linux/Vivado 2024.2
Operating Temperature: -55°C to +125°C (Military)
Environment Specification: REACH & RoHS3 Compliant
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  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • 10G Ethernet through SFP+ Connector
  • 12G SDI Video IN through HD BNC Connector
  • 12G SDI Video OUT through HD BNC Connector
  • 4K HDMI 2.0 IN through HDMI Connector
  • 4K HDMI 2.0 OUT through HDMI Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP 1.2a Display Port Connector
  • PCIe Gen2 x4 & M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • Standard SD & Dual PMOD Connector
  • CAN Header & 20 Pin Header (for PS IOs)

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