Zynq™ UltraScale+™ XQ MPSoC 19/11EG System on Module – MIL Grade

iG-G35M-ML®

  • Zynq™ UltraScale+™ XQ MPSoC family with FFRC1760 package
  • Compatible with ZU19/ZU11 EG devices
  • 4GB DDR4 RAM for PS with ECC & Dual 4GB DDR4 RAM for PL
  • 32GB eMMC Flash (Expandable up to 128GB) & 256MB QSPI Flash
  • Up to 1143K Logic cells & 522K LUTs
  • 16 GTY Transceivers, 32 GTH Transceivers, 4 GTR Transceivers and 174 IOs
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Features Details
SoC ZU19/ZU11 EG
Processing System (PS)

  • Quad/Dual Arm Cortex-A53 at 1.2GHz, Dual Cortex-R5 at 500MHz
  • Arm Mali-400MP2 GPU @600MHz

Programming Logic (PL)

  • Up to 1143K Logic cells and 522K LUTs
  • PL GTY High Speed Transceivers x16 at 28.2Gb/s
  • PL GTH High Speed Transceivers x32 at 16.3Gb/s
Memory 64bit, 4GB DDR4 RAM for PS with ECC
64bit, Dual 4GB DDR4 RAM for PL
Storage 32GB eMMC Flash (Expandable up to 128GB)
256MB QSPI
2Kb EEPROM
240pin High-Speed Board to Board Connector 1 Interfaces From PS Block

  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • GEM3 RGMII Interface or ULPI Interface x 1
  • CAN Interface x 2

From PL Block

  • High Speed GTH Transceiver Lanes x 12 (Up to 12.5Gbps)
  • HD Bank IOs – Up to 46 Single Ended IO’s
  • ADC Input pins- Up to 32 Single Ended IOs from HD Banks
240pin High-Speed Board to Board Connector 2 Interfaces From PS Block

  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • SD (4bit) x 1
  • Debug UART and Data UART x 1
  • SPI x 1(Optional)
  • I2C x 2 Port
  • JTAG x 1

From PL Block

  • High Speed GTH Transceiver Lanes x 4 (Up to 12.5Gbps)
  • HP Bank IOs – Up to 48 LVDS/96 Single Ended IO’s
  • ADC Input pins – Up to 16 Differential/Single Ended HP Banks
240pin High-Density Board to Board Connector 3 Interfaces PL-GTY High Speed Transceivers (up to 25.785Gbps) x 16
PL-GTH High Speed Transceivers (up to 12.5Gbps) x 8
80pin High-Density Board to Board Connector 4 Interfaces PL-GTH High Speed Transceivers (up to 12.5Gbps) x 8
General Features Power Input: 5V through B2B Connector2
Form Factor: 75mm x 110mm (OREN+)
BSP Support: Linux/Vivado 2024.2
Operating Temperature: -55°C to +125°C (Military)
Environment Specification: REACH & RoHS3 Compliant
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  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • 10G Ethernet through SFP+ Connector
  • 12G SDI Video IN through HD BNC Connector
  • 12G SDI Video OUT through HD BNC Connector
  • 4K HDMI 2.0 IN through HDMI Connector
  • 4K HDMI 2.0 OUT through HDMI Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP 1.2a Display Port Connector
  • PCIe Gen2 x4 & M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • Standard SD & Dual PMOD Connector
  • CAN Header & 20 Pin Header (for PS IOs)

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