Agilex™ 9 R31D Mid-band Direct RF System on Module

iG-G78M®

  • Altera Agilex™ 9 AGRM027 Direct RF Mid-band SoC FPGA Device
  • Up to 2.7M Logic Elements, 17056 18x18 Multiplier
  • 32x high-speed FGT transceivers up to 58 Gbps PAM4
  • 20x ADC with Sampling rate up to 4Gsps
  • 16x DAC with Sampling rate up to 12Gsps
  • Industrial operating temperature range from −40 °C to +100 °C
  • Form Factor: 82 x 110 mm (BRYNc)
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Features Details
Direct RF Soc FPGA Agilex 9 Mid-band Direct RF SoC FPGA

Hard Processing System (HPS)

  • Quad-core 64-bit ARM® Cortex®-A53 up to 1.4GHz

Field Programmable Gate Array (FPGA)

  • Up to 2,692,760 Logic elements
  • 32 x FGT transceivers up to 58Gbps PAM4
  • ADC x 20 with Sampling rate up to 4Gsps
  • DAC x 16 with Sampling rate up to 12Gsps
Memory
  • 8GB DDR4 with ECC for HPS (64bit + 8bit)
  • 2 x 8GB DDR4 with ECC for FPGA (64bit + 8bit)
Storage
  • 8bit eMMC (32GB Upgradable)
  • QSPI Flash (1Gb Upgradable)
  • EEPROM (2Kb Upgradable)
On SoM Features
  • Gigabit Ethernet PHY x 1
  • USB 2.0 through On SOM PHY x 1
  • On Board Clock Generators
  • Fan header
Board to Board Connector Interfaces: Board to Board Connector 1

  • ADC x 16 (up to 4 Gsps)
  • ADC FB x 4 (up to 4 Gsps)
  • DAC x 16 (Up to 12 Gsps)
  • FPGA IOs (96LVDS/192SE)

Board to Board Connector 2

  • Gigabit Ethernet x 1 Port
  • USB 2.0 OTG x 1 Port
  • I2C x 1 Port
  • Debug UART x 1 Port
  • UART (With CTS and RTS) x 1 Port
  • SDM JTAG x 1 port
  • High Speed Transceivers x 32 (up to 58Gbps – PAM4)
General Features
  • Power Input: 12V input through Board-to-Board Connector2
  • Operating Temperature: -40°C to 100°C
  • Operating System: Linux
  • Form Factor: 82 X 110 mm (BRYNc)
  • Environment Specification: REACH & RoHS3 Compliant

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RF-ADC/DAC Customization

Tailor resolution, sampling rates, and channel configurations to match your signal processing and bandwidth needs.

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Interface Integration

Optimize JESD204B/C, high-speed serial links, and RF front-end connections for seamless system-level integration.

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Rugged & Military-Grade Designs

Develop 3U VPX conduction-cooled systems and RF connector layouts built for extreme conditions available in both industrial and MIL grade.

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End-to-End ODM Services

From carrier + SoM integration for SDR, EW, and radar to schematic, PCB layout, thermal, mechanical, and enclosure design, we provide complete product realization.

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FAQs

Agilex™ System on Modules provide a production-ready FPGA platform with proven signal integrity, DDR tuning, and power sequencing. They reduce development risk, shorten design cycles, and accelerate time-to-market for high-performance embedded systems.

Agilex™ FPGA system on modules are supported with a Yocto-based Linux BSP including bootloader, kernel, and root filesystem. They also support bare-metal development through the Altera HAL for Nios® V (RISC-V) processors.

Yes. Agilex™ solutions support Remote System Update (RSU) with factory and application image management, enabling secure fallback, trusted recovery, and reliable field upgrades.

  • Ultra-High-Speed Networking & Compute Scalability
  • Precision Time Synchronization & Deterministic Networking
  • RF-Optimized Clocking & Power Architecture
  • Compact, Pin-Compatible & Deployment-Ready Designs

With high-speed PCIe connectivity, dynamic FPGA reconfiguration, and robust Linux support, Agilex™ enables acceleration for AI, networking, data centers, and high-performance embedded systems.

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Remote System Update (RSU) on Agilex™ SoC FPGA

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