i.MX 8XLite OSM – SE LGA
System on Module
iG-G46M®
- i.MX 8XLite CPU with Dual/Solo Arm Cortex-A35 & Arm Cortex-M4F
- 2GB LPDDR4 Memory
- 8GB eMMC Flash expandable up to 16GB
- Usage of AEC Qualified Automotive Components (AEC-Q104*)
- Supports 1× 1Gb Ethernet with AVB
- V2X, Connected Automotive and Industrial IoT Applications
Documents
Design Support
Software
| Features | Details |
|---|---|
| On Module Feature | CPU
Memory & Storage
|
| OSM BGA Features | RGMII x 2 USB 2.0 OTG x 1 USB 2.0 HOST x 1 PCIe3.0 x 1 CAN x 2 UART x 3 (1 is optional) 18-bit RGB I2S x 1 SPI x 1 I2C x 2 JTAG x 1 GPIOs |
| OS Support | Linux 6.1.22 |
| General Features | Power Input: 5V, 2.5A through OSM LGA Form Factor: 30mm x 30mm (Size S) Operating Temperature: -40°C to +105°C (AEC-Grade 3) Environment Specification: REACH & RoHS3 Compliant |
Note: Optional features are not supported in default configuration
- Dual 1000/100/10 Mbps Ethernet
- CAN Header x 1
- USB 2.0 OTG (micro–AB Receptacle Connector) x 1
- Debug UART Header x 1
- USB2.0 Header x 1
- Speaker Header
- Audio In & Out Jack through I2S Codec x 1
- RS232 Header x 1 (without CTS/RTS)
- M.2 Connector Key B/M (Key M is optional)
Thermal design is a critical aspect for any highly integrated OSM module. iWave offers Heat Sink and Heat Spreader solution for i.MX 8XLite OSM LGA Module.
Enclosure is important for any SBC, and iWave offers rugged aluminum and metal options that protect the device while ensuring full access to all major ports.
