Versal™ Prime
System on Module

iG-G57M®

  • Versal™ Prime SoC Compatible with VM1102 device
  • Up to 328K Logic cells & 150K LUTs
  • Dual-core Arm Cortex-A72 (1.65GHz) + Cortex-R5F (800MHz)
  • 8 GTYP Transceivers up to 32Gbps
  • Compact 50mm x 60mm form factor
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Features Details
SoC VersalTM Prime SoC with SFVA784 package
Compatible with VM1102 device
Dual-core Arm Cortex-A72 @1.65GHz
Dual-core Arm Cortex-R5F @800MHz
Up to 328K Logic cells and 150K LUTs
Memory 64bit 4GB LPDDR4 (Expandable)
2Kbit EEPROM
Storage 16GB eMMC Flash (Expandable up to 128GB)
256MB QSPI Flash
Board to Board Connector Interfaces From PL Block

  • GTYP Transceivers x8 up to 32Gbps
  • 39 LVDS 78 SE from XPIOs
  • 20 SE from HDIO

From PS Block

  • RGMII x 1
  • 1G Ethernet
  • USB2.0 x 1
  • SD1 (4-bit) x 1
  • Debug UART x 1
  • PMC I2C x 1
  • SPI1(3CS) x 1
  • CAN FD x 1
  • JTAG x 1
Other On SoM Features 10/100/1000 Ethernet PHY
USB Transceiver PHY
6-bit Clock Synthesizer and oscillators
FAN Header
Software Features Yocto / PetaLinux BSP with Vivado hardware support
Linux driver support for PL (Programmable Logic) and DMA subsystems
High-speed I/O and networking stack support (PCIe, Ethernet, etc.)
RF data converter support (specific to Versal RF devices)
Bare-metal and real-time low-latency application support
Vitis development environment for acceleration
General Features
  • Power Supply: 12V through B2B Connector
  • Form Factor: 50mm x 60mm (REN)
  • Operating Temperature: -40°C to +85°C
  • Environment Specification: REACH & RoHS3 Compliant
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  • FMC+ High Serial Pin Count (HSPC) Connector
  • 4K HDMI 2.0 IN and OUT through HDMI Connector
  • 12G SDI Video IN and OUT through HD BNC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB Type-C for JTAG and PS Debug port
  • USB 2.0 Interface through USB Type C Connector
  • Micro SD
  • PMOD Connector
  • 60 Pin GPIO Header (For PS IOs)
  • Operating Temperature: -20°C to +70°C
  • Form Factor: 120mm x 120mm

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For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Fan Sink solution for Versal Prime SoM.

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Product Design Process

Our design process transforms your vision into reality with innovation, quality, and collaboration.

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Certification & Qualification

Ensuring Compliance, Quality, and Trust Through Certification & Qualification.

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Product Lifecycle Management

Ensuring Longevity, Reliability, and Seamless Product Evolution.

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Mechanical Services

Precision Engineering for Reliable, High-Performance Mechanical Solutions.

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FAQs

The AMD Versal™ Adaptive SoC is a next-generation adaptive computing platform that combines CPUs, programmable logic (FPGA), AI engines, DSP engines, and high-bandwidth networking on a single device.

Unlike traditional SoCs or FPGAs, Versal™ devices integrate multiple compute engines connected through a high-speed Network-on-Chip (NoC). This architecture allows developers to run AI, signal processing, and embedded applications efficiently in a single platform.

Yes. Versal™ AI Edge devices integrate AI engines and programmable logic to accelerate machine learning inference, vision processing, and real-time analytics. This makes them ideal for edge AI applications where low latency and high performance are required.

Versal™ SoM platforms support multiple high-speed interfaces including PCIe Gen4 and Gen5, Ethernet connectivity, and multi-gigabit transceivers that can reach speeds up to 112 Gbps depending on the device family.

Yes. With support for high-speed transceivers, PCIe Gen5, and MAC interfaces up to 600G, Versal™ SOM platforms are well suited for networking, data processing, and communication infrastructure applications.

Versal™ devices are more advanced than traditional FPGAs because they combine multiple processing engines in a single platform. They integrate CPUs, programmable logic, AI engines, and DSP blocks to handle different types of workloads efficiently.

Key benefits include:

  • Heterogeneous compute architecture for flexible processing
  • Software-programmable acceleration for faster development
  • High-bandwidth and deterministic data movement
  • Integrated high-speed transceivers for multi-gigabit connectivity
  • Scalable platform for AI, networking, and embedded applications
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