Versal™ AI Edge XQ System on Module – MIL Grade

iG-G57M-ML®

  • Versal™ AI Edge XQ with SSRA784 Package
  • Compatible with XQVE2302, XQVE2102 & XQVM1102 Devices
  • Up to 329K Logic Cells & 150K LUTs
  • 4GB LPDDR4 Memory and 4Mb EEPROM
  • 32GB eMMC and 256MB QSPI Flash
  • Up to 8 GTYP Transceivers and 27LVDS/54SE from XPIOs & 20SE from HDIOs
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Features Details
SoC/FPGA Versal™ AI Edge XQ SoC with SSRA784 Package
Dual-core Arm Cortex-A72 Processor APU @1.3GHz
Dual-core Arm Cortex-R5F Processor RPU @600MHz
Compatible with XQVE2302, XQVE2102 & XQVM1102 Devices
Up to 329K Logic Cells & 150K LUTs
Up to 34 AIE-ML Tiles with 68Mb AIE-ML Shared Memory
Memory 64-bit, 4GB LPDDR4 with 8-bit ECC (Upgradable up to 8GB)
Storage 32GB eMMC Flash (Upgradable up to 64GB)
256MB QSPI Flash
4Mb EEPROM
Board to Board Connectors Interfaces From PL Block

  • Up to 8 GTYP Transceivers at 26.5625Gbps
  • Up to 27LVDS/54SE from XPIOs & 20SE from HDIOs

From PS Block

  • Select MAP (8-bit) x1
  • GEM0 10/100/1000Mbps Ethernet x1
  • GEM1 RGMII x1
  • SD1 (4-bit) x 1
  • Debug UART x1
  • JTAG x1
  • SPI (3CS) x1
  • CAN FD x1
  • PMC I2C x1
Other Features 10/100/1000Mbps Ethernet PHY x1
Fan Header ×1
General Features Power Input: 5V through B2B Connector
Form Factor: REN
BSP Support: Linux/Vivado 2024 or above
Operating Temperature: -55°C to +125°C
Environment Specification: REACH & RoHS3 Compliant

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