Documents
Design Support
Software
| Features | Details |
|---|---|
| On Module Feature | CPU
Memory & Storage
|
| Audio/Video Features | 3.5mm Audio IN/OUT Jack Speaker Out Header |
| Miscellaneous Interfaces | Debug UART Connector RTC Battery Connector JTAG Header M.2 Key-B Connector PCIe 3.0 ×1 USB 2.0 x 1 |
| Expansion Connector Features | UART x 1 (Optional) CAN x 1 Port Tamper x 2 |
| OS Support | Linux 6.1.22 |
| General Features | Power Input: 7V to 24V Form Factor: 100mm X 72mm Operating Temperature: -40°C to +85°C (Industrial) Environment Specification: REACH & RoHS3 Compliant |

- i.MX 8XLite CPU with Dual/Solo Arm Cortex-A35 & Arm Cortex-M4F
- 2GB LPDDR4 Memory
- 8GB eMMC Flash expandable up to 16GB
- Usage of AEC Qualified Automotive Components (AEC-Q104*)
- Supports 1× 1Gb Ethernet with AVB
- V2X, Connected Automotive and Industrial IoT Applications



Thermal design is a critical aspect for any highly integrated OSM module. iWave offers Heat Sink and Heat Spreader solution for i.MX 8XLite Pico ITX SBC Module.
Enclosure is important for any SBC, and iWave offers rugged aluminum and metal options that protect the device while ensuring full access to all major ports.



