i.MX 8XLite Pico ITX
Single Board Computer

iG-G46S®

  • i.MX 8XLite Dual/Solo CPU with Arm Cortex-A35 core
  • Carrier Board Integrated with the i.MX 8XLite OSM SoM
  • 2GB LPDDR4, 8GB eMMC Flash and 16Mb SPI NOR Flash
  • Supports Dual Gigabit Ethernet
  • Production Ready Solution
  • 100mm x 72mm Pico ITX Form Factor
CONTACT SALES
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Documents

Features Details
On Module Feature CPU

    • i.MX 8XLite Dual: 2 x Cortex-A35, 1 x Cortex-M4F
    • i.MX 8XLite Solo: 1 x Cortex-A35, 1 x Cortex-M4F

Memory & Storage

    • 2GB LPDDR4
    • 8GB eMMC Flash expandable up to 16GB
    • 16Mb SPI Flash
Audio/Video Features 3.5mm Audio IN/OUT Jack
Speaker Out Header
Miscellaneous Interfaces Debug UART Connector
RTC Battery Connector
JTAG Header
M.2 Key-B Connector
PCIe 3.0 ×1
USB 2.0 x 1
Expansion Connector Features UART x 1 (Optional)
CAN x 1 Port
Tamper x 2
OS Support Linux 6.1.22
General Features Power Input: 7V to 24V
Form Factor: 100mm X 72mm
Operating Temperature: -40°C to +85°C (Industrial)
Environment Specification: REACH & RoHS3 Compliant
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  • i.MX 8XLite CPU with Dual/Solo Arm Cortex-A35 & Arm Cortex-M4F
  • 2GB LPDDR4 Memory
  • 8GB eMMC Flash expandable up to 16GB
  • Usage of AEC Qualified Automotive Components (AEC-Q104*)
  • Supports 1× 1Gb Ethernet with AVB
  • V2X, Connected Automotive and Industrial IoT Applications

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Thermal design is a critical aspect for any highly integrated OSM module. iWave offers Heat Sink and Heat Spreader solution for i.MX 8XLite Pico ITX SBC Module.

Enclosure is important for any SBC, and iWave offers rugged aluminum and metal options that protect the device while ensuring full access to all major ports.

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Precision Engineering for Reliable, High-Performance Mechanical Solutions.

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