Versal™ Prime Gen2
System on Module
iG-G77M®
- Versal™ Prime Gen2 SoC with SSVA2112 package
- Compatible with 2VM3858, 2VM3654 and 2VM3558 Devices
- Supports Video Codec Unit and Image Signal Processor
- Up to 1188K Logic cells and 543K LUTs
- 24 channels of GTYP transceivers up to 32Gbps
- Form factor 70mm x 80mm (REN+) with -40°C to +85°C (Industrial)
Documents
| Features | Details |
|---|---|
| SoC | Versal™ Prime Gen2 SoC with SSVA2112 package Compatible with 2VM3858, 2VM3654 and 2VM3558 Devices 8x Arm Cortex- A78AE (up to 2.2GHz) and 10x Cortex R52(up to 1.05GHz) 4-core Arm Mali-G78AE Graphic Processing Unit (up to 1.05GHz) Supports Video Codec Unit and Image Signal Processor Up to 1188K Logic cells and 543K LUTs |
| Memory | Four 32bit, 4GB LPDDR5x 2Kbit EEPROM |
| Storage | 256MB OSPI flash 32GB eMMC Flash 64GB UFS flash (Optional) |
| Board to Board Connector Interfaces | From PL Block:
From PS Block:
|
| Other On SOM Features | 10/100/1000 Ethernet PHY with PTP Programmable Clock Synthesizer 32.768KHz crystal for RTC FAN Header |
| Software Features | Yocto / PetaLinux BSP with Vivado hardware support Linux driver support for PL (Programmable Logic) and DMA subsystems High-speed I/O and networking stack support (PCIe, Ethernet, etc.) RF data converter support (specific to Versal RF devices) Bare-metal and real-time low-latency application support Vitis development environment for acceleration |
| General Features | Power Input: 5V through B2B Connector Form Factor: 70mm x 80mm (REN+) BSP Support: Petalinux 2025.1 or above Operating Temperature: -40°C to +85°C (Industrial) Environment Specification: REACH & RoHS3 Compliant |
- 100G Ethernet though QSFP+ Connector
- SDI IN/OUT Connector
- HDMI IN/ OUT Connector
- FMC+ High Pin Count (HPC) Connector
- Dual Gigabit Ethernet through RJ45 MagJack
- PCIe Gen5 Connector
- DP Connector
- USB 3.0 and USB2.0 through TypeC Connector
- USB Type-C Connector for JTAG and PS Debug port
- Micro SD Connector
- PMOD Connector
- 60 Pin GPIO Header (For PS IOs)
- User LED and DIP switch
- Operating Temperature: -20°C to +85°C
- Form Factor: 120mm x 120mm
For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Fan Sink solution for Versal™ Prime Gen2 SOM
FAQs
The AMD Versal™ Adaptive SoC is a next-generation adaptive computing platform that combines CPUs, programmable logic (FPGA), AI engines, DSP engines, and high-bandwidth networking on a single device.
Unlike traditional SoCs or FPGAs, Versal™ devices integrate multiple compute engines connected through a high-speed Network-on-Chip (NoC). This architecture allows developers to run AI, signal processing, and embedded applications efficiently in a single platform.
Yes. Versal™ AI Edge devices integrate AI engines and programmable logic to accelerate machine learning inference, vision processing, and real-time analytics. This makes them ideal for edge AI applications where low latency and high performance are required.
Versal™ SoM platforms support multiple high-speed interfaces including PCIe Gen4 and Gen5, Ethernet connectivity, and multi-gigabit transceivers that can reach speeds up to 112 Gbps depending on the device family.
Yes. With support for high-speed transceivers, PCIe Gen5, and MAC interfaces up to 600G, Versal™ SOM platforms are well suited for networking, data processing, and communication infrastructure applications.
Versal™ devices are more advanced than traditional FPGAs because they combine multiple processing engines in a single platform. They integrate CPUs, programmable logic, AI engines, and DSP blocks to handle different types of workloads efficiently.
Key benefits include:
- Heterogeneous compute architecture for flexible processing
- Software-programmable acceleration for faster development
- High-bandwidth and deterministic data movement
- Integrated high-speed transceivers for multi-gigabit connectivity
- Scalable platform for AI, networking, and embedded applications
