Documents
| Features | Details |
|---|---|
| CPU | i.MX 9352: 2 x Cortex-A55, NPU i.MX 9351: 1 x Cortex-A55, NPU i.MX 9332: 2 x Cortex-A55 i.MX 9331: 1 x Cortex-A55 |
| Memory & Storage | 2GB LPDDR4/4X (By default, LPDDR4X is supported) 16GB eMMC Flash expandable up to 256GB |
| Other | Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 1:4 USB2.0 HUB External RTC Controller Programming Header |
| OSM LGA Features | RGMII x 2 SD(4bit) x 1 USB 2.0 OTG x 1 USB 2.0 HOST x 4 LVDS x 1 2 lane MIPI CSI x 1 4 lane MIPI DSI x 1 CAN x 2 UART x 3 (1 is optional) Debug UART x 1 I2S x 1 SPI x 1 I2C x 2 PWM x 1 JTAG x 1 ADC x 4 Tamper x 2 GPIOs |
| OS Support | Linux 6.1.22 Debian OS FreeRTOS |
| General Features | Power Input: 5V, 2.5A through OSM BGA Form Factor: 45mm x 45mm (Size L) Operating Temperature: -40°C to +85°C (Industrial) Environment Specification: REACH & RoHS3 Compliant |

- Dual 1000/100/10 Mbps Ethernet
- CAN Header x 1
- USB 2.0 OTG (micro–AB Receptacle Connector) x 1
- Dual USB 2.0 Host (TypeA) x 1
- Micro SD
- 4 Lane MIPI DSI Display Connector
- 2 Lane MIPI DSI Display Connector (Optional)
- 4 Lane LVDS Display Connector
- MIPI CSI Camera Connector
- Debug UART Header x 1
- 3.5mm Audio In & Out Jack through I2S Codec x 1
- GNSS receiver Module –GPS/GLONASS/Galileo/BeiDou (Optional)
- M.2 Connector Key B/M (Key M is optional)
- USB Touch Header x 1
- LINE IN & OUT Speaker Headers
- RS232 Header x 1



Thermal design is a critical aspect for any highly integrated OSM module. iWave offers Heat Sink and Heat Spreader solutions specifically for the i.MX93 OSM LGA Module
Enclosure is important for any SBC, and iWave offers rugged aluminum and metal options that protect the device while ensuring full access to all major ports.



