i.MX 93 OSM
System on Module

iG-G50M®

  • i.MX 93 CPU with Dual Arm Cortex-A55 & Arm Cortex-M33
  • NPU with up to 0.5 TOPS Neural Network performance
  • 2GB LPDDR4/4X Memory
  • 16GB eMMC Flash expandable up to 256GB
  • Wi-Fi 6 and Bluetooth 5.3 Connectivity
  • Supports 2 × 1Gbps Ethernet (1 with TSN)
CONTACT SALES
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Documents

Features Details
CPU i.MX 9352: 2 x Cortex-A55, NPU
i.MX 9351: 1 x Cortex-A55, NPU
i.MX 9332: 2 x Cortex-A55
i.MX 9331: 1 x Cortex-A55
Memory & Storage 2GB LPDDR4/4X (By default, LPDDR4X is supported)
16GB eMMC Flash expandable up to 256GB
Other Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4
1:4 USB2.0 HUB
External RTC Controller
Programming Header
OSM LGA Features RGMII x 2
SD(4bit) x 1
USB 2.0 OTG x 1
USB 2.0 HOST x 4
LVDS x 1
2 lane MIPI CSI x 1
4 lane MIPI DSI x 1
CAN x 2
UART x 3 (1 is optional)
Debug UART x 1
I2S x 1
SPI x 1
I2C x 2
PWM x 1
JTAG x 1
ADC x 4
Tamper x 2
GPIOs
OS Support Linux 6.1.22
Debian OS
FreeRTOS
General Features Power Input: 5V, 2.5A through OSM BGA
Form Factor: 45mm x 45mm (Size L)
Operating Temperature: -40°C to +85°C (Industrial)
Environment Specification: REACH & RoHS3 Compliant
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  • Dual 1000/100/10 Mbps Ethernet
  • CAN Header x 1
  • USB 2.0 OTG (micro–AB Receptacle Connector) x 1
  • Dual USB 2.0 Host (TypeA) x 1
  • Micro SD
  • 4 Lane MIPI DSI Display Connector
  • 2 Lane MIPI DSI Display Connector (Optional)
  • 4 Lane LVDS Display Connector
  • MIPI CSI Camera Connector
  • Debug UART Header x 1
  • 3.5mm Audio In & Out Jack through I2S Codec x 1
  • GNSS receiver Module –GPS/GLONASS/Galileo/BeiDou (Optional)
  • M.2 Connector Key B/M (Key M is optional)
  • USB Touch Header x 1
  • LINE IN & OUT Speaker Headers
  • RS232 Header x 1

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Thermal design is a critical aspect for any highly integrated OSM module. iWave offers Heat Sink and Heat Spreader solutions specifically for the i.MX93 OSM LGA Module

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