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Design Support
Software
| Features | Details |
|---|---|
| CPU | i.MX 9352: 2 x Cortex-A55, NPU i.MX 9351: 1 x Cortex-A55, NPU i.MX 9332: 2 x Cortex-A55 i.MX 9331: 1 x Cortex-A55 |
| Memory & Storage | 2GB LPDDR4/4x (By default, LPDDR4X is supported) Micro SD 16Mb SPI Flash 16GB eMMC Flash expandable up to 128GB |
| Network & Communication | Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 Gigabit Ethernet x 2 (Dual RJ45 Mag-jack Connector) CAN Header x 1 USB 2.0 OTG (micro–AB Receptacle Connector) USB 2.0 x 2 (Dual-stack Type-A Connector) USB Header x 1 Micro SD RS232 Header x 1 GNSS receiver Module -GPS/GLONASS/Galileo/BeiDou |
| Audio/Video Features | 3.5mm Audio IN/OUT Jack Speaker Out Header 4 Lane LVDS Display Connector 4 Lane MIPI DSI Display Connector x 1 2 Lane MIPI DSI Display Connector (Optional) x 1 MIPI CSI Camera Connector x 1 |
| Miscellaneous Interfaces | Debug UART Connector RTC Connector JTAG Header M.2 Connector Key B USB 2.0 x 1 |
| Expansion Connector Features | UART x 1 (Optional) CAN x 1 Port ADC x 2 (Optional) PWM x 1 Tamper x 2 |
| OS Support | Linux 6.1.22 QNX 7.1 |
| General Features | Power Input: 7V to 24V (By defualt, 12V) Form Factor: 100mm X 72mm Operating Temperature: -40°C to +85°C (Industrial) Environment Specification: REACH & RoHS3 Compliant |

- MX 93 CPU with Dual Arm Cortex-A55 & Arm Cortex-M33
- 1GB LPDDR4X Memory
- 8GB eMMC Flash Memory
- NPU with up to 0.5 TOPS Neural Network performance
- Supports 1Gbps Ethernet x 2
- Form Factor: 30mm x 30mm (Size-S)


For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink solution for i.MX93 OSM LGA Module.



