RFSoC Based Rugged SDR

• Quad-core ARM Cortex-A53 MPCore Application processor (up to 1.3GHz)
• Dual-core ARM Cortex-R5 MPCore Real Time Processor (up to 533MHz)

Programming Logic (PL)

• Programming Logic (PL) with up to 930K Logic cells
• PL GTY High Speed Transceivers x 8 @ upto 28.21 Gbps

Intel Core Ultra Processor
CPU

• 1st Gen Core™ Ultra Processor (formerly “Meteor Lake-H/U”)

NPU

• Up to 8.2 TOPS, integrated

GPU

• Intel® Xe Graphics architecture with up to 128 execution units

Embedded BIOS

• AMI UEFI with CMOS backup in 32MB SPI BIOS

• 64bit, 8GB DDR4 RAM for PS with ECC
• 64bit, 8GB DDR4 RAM for PL

Intel Core Ultra Processor based COM-HPC Mini Module

• Up to 64GB (4x 16GB) LPDDR5

• 256MB QSPI Flash for Booting
• 32GB eMMC Flash for Storage
• 2-Kbit EEPROM

Intel Core Ultra Processor based COM-HPC Mini Module

• 128GB NVMe SSD PCIe x4

• Integrated Configurable ultra low noise PLL for ADC & DAC
• Fully Configurable Clock Synthesizer with SyncE and PTP support

• 3 DAC SMA channels with 10MHz – 1.8GHz Frequency Bandwidth(Configurable) @ upto 9.85 GSPS sampling rate and 20dB output Gain support.
• 1 DAC SMA channel with 10MHz – 1.8GHz Frequency Bandwidth(Configurable) @ upto 9.85 GSPS sampling rate.

4 ADC SMAs

• 2 ADC SMA channels with 10MHz – 1GHz Frequency Bandwidth(Configurable) @ upto 5 GSPS sampling rate and 23dB output Gain and 31dB Dynamic Digital Attenuation support.
• 1 ADC SMA channels with 10MHz – 1.8GHz Frequency Bandwidth(Configurable) @ upto 5 GSPS sampling rate and 30dB output Gain support.
• 1 ADC SMA channels with 10MHz – 1.8GHz Frequency Bandwidth(Configurable) @ upto 5 GSPS sampling rate.

1PPS SMA x1

• For SyncE,PTP and system syncronization applications.

10MHz SMA x1

• For RF tracking/syncronization applications.

• USB 3.0 through USB Type-A Connector x1
• Micro SD Port x1
• USB Type-C Connector for JTAG/Debug Purpose x1
• RFSoC SOM Boot Mode Switch
• Power, FPGA Configuration Status and Ethernet LEDs

Intel Core Ultra Processor based COM-HPC Mini Module

• USB 3.0 through USB Type-A Connector x2
• 4K Display interface through DP Connector x1
• COM-HPC-Mini Boot Mode Switch
• Power Status and Ethernet LEDs

• 10/100/1000 Mbps Ethernet x1
• HP Bank IOs x8

Intel Core Ultra Processor based COM-HPC Mini Module

• PCIe Gen4 x4 Interface for multi system connectivity
• 10/100/1000 Mbps Ethernet x1
• 10/100 Mbps Ethernet x1
• USB 2.0 Interface x1
• RS422 Interface x1
• GPIO x1
• System Power Enable/Disable Control

• PCIe Gen4 x4 Interface between RFSoC (Endpoint) and COM-HPC Mini (Rootport)
• On-board VI Monitors
• On-board Temperature Sensor
• Fan with RPM Control
• COM_HPC Mini Module Power Control IOs
• RFSoC SOM Reset Switch x1
• RTC Connector x1 (Optional)

Intel Core Ultra Processor based COM-HPC Mini Module

• M.2 Key.M PCIe Gen4 x4 Slot x1
• EEPROM x1
• COM-HPC-Mini Reset and Power Switch x1

• Power Input: 28V (18V ~ 36V) Input through D38999 Power Connector
• Thermal Solution: Rugged Metal Enclosure with 3300 RPM Cooling Fan.
• Form Factor: 220mm X 178mm X 88mm
• Operating Temperature: -40°C to +85°C (Industrial)
• Environment Specification: REACH & RoHS Compliant