iWave Global, a leader in embedded computing and FPGA System on Modules (SOM) has launched the iG-G57M-SP, a space grade Versal™ AI Edge XQR SOM, engineered to deliver high-performance AI acceleration, deterministic signal processing, and radiation-tolerant reliability for spaceborne payloads and edge intelligent systems.
This radiation-tolerant SOM is based on the AMD Versal™ AI Edge XQR Adaptive SoC and is designed for missions requiring powerful onboard processing, low-latency inference, and long-duration operation in harsh orbital environments. The module integrates advanced compute AI engines, logic cells, high-speed connectivity, and robust memory subsystems in a compact form factor, making it ideal for Low Earth Orbit (LEO), Medium Earth Orbit (MEO), and Geostationary Earth Orbit (GEO) missions.
Features of iG-G57M-SP System on Module
- Versal™ AI Edge XQR with SSRA784 Package
- Compatible with XQRVE2302 device
- Up to 329K Logic Cells & 150K LUTs
- 34 AIE-ML tiles and 464 DSP slices
- 4GB DDR4, 32GB eMMC, 64MB QSPI Flash and 4Mb EEPROM
- Board to connector for high-speed transceiver and high performance IOs
- 8 GTYP transceivers supporting up to 26.5625 Gbps
- 27LVDS/54 SE from XPIO and 20SE from HDIOs
- Radiation metrics – TID: 30 krad (Si), SEL: 43 MeV × cm²/mg, and SEU: 60 MeV.cm²/mg
- Operating temperature: –55°C to +125°C
- Compliant with MIL-STD-883E Group D & E
- Integrated crystal oscillators and crystals for RTC.
- Space-qualified PHY options for Ethernet on SOM for gigabit ethernet
The iG-G57M-SP® combines the compute density of the Versal™ AI Edge XQRVE2302 device with a rugged, space-qualified design optimized for long-duration missions. Its heterogeneous processing system featuring dual Arm Cortex-A72 and dual Arm Cortex-R5F cores supports parallel real-time control and AI inference on a single platform, enabling next-generation space workloads such as Autonomous navigation & guidance, Onboard AI/ML-based image analytics, Software-defined payloads, High-throughput sensor and RF data processing.
Engineered for radiation resilience, Versal™ AI Edge XQR SOM can withstand space environment with a total Ionizing Dose (TID) of up to 30 krad (Si), offers Single-Event Latchup (SEL) immunity beyond 43 MeV·cm²/mg, and demonstrates Single-Event Upset (SEU) robustness above 60 MeV·cm²/mg. These capabilities ensure deterministic operation even in radiation-intense orbits, making the module a robust choice for future-proof space systems.
“The Versal™ AI Edge XQR SoM marks a major step forward in enabling intelligent, autonomous space systems,” said Pradap Raj, Associate Director – System on Modules, iWave Global. “By combining radiation-tolerant compute with AI acceleration and high-speed interfaces, iWave is empowering satellite OEMs to build smarter, faster, and more adaptable payloads for next-generation space missions.”
The space-grade Versal™ AI Edge XQR device integrates AI Engines, programmable logic, and hardened processing subsystems in a radiation-tolerant design. Built on advanced process technology with extended testing for space conditions, the XQR family is optimized for low-Earth and deep-space missions requiring high compute density, low latency, and secure, reliable operation.
The iG-G57M-SP® System on Module is currently available for early access customers. Evaluation kits and engineering samples can be requested through the iWave sales team at mktg@iwave-global.com.
iWave Global is a leading provider of embedded computing solutions, FPGA System on Modules, and ODM design services, enabling next-generation innovation across industrial, automotive, medical, aerospace, and defense markets. With over 26 years of engineering excellence, iWave specializes in high-performance SoMs built on cutting-edge processor technologies. Through deep domain expertise in FPGA, RF, AI, and edge compute architectures, iWave partners with global OEMs to accelerate product development, reduce technical risk, and deliver reliable solutions for mission-critical applications. For more information, visit www.iwave-global.com.
