FPGA modules are vital in developing flexible and high-performance designs. System designers should consider the scalability of FPGA SOMs, choosing a module that is suited to current needs while offering support for future performance enhancements.
iWave’s FPGA System-on-Modules (SOMs) are optimized to provide scalable solutions for various embedded and high-performance applications, offered in a variety of form factors including REN, REN+, OREN, OREN+, BYRN, and BRYN+, aligning with varied system requirements and application specifications.
From compact REN and REN+ modules optimized for low-power embedded devices, to OREN and OREN+ modules optimized for mid-range AI and networking, and all the way to high-end BYRN and BRYN+ modules designed for compute-intensive and high-speed data processing applications. iWave offers a modular approach that balances size, connectivity, memory, and processing capabilities across all FPGA solutions. This range ensures designers can scale their systems efficiently, choosing the right form factor for their application without losing performance or integration flexibility.
What is REN/REN+?
The REN and REN+ form factors are designed as compact FPGA system on modules optimized for space-constrained and low-power applications. These modules provide a higher number of FPGA IOs while featuring a lower number of high-speed transceivers, making them ideal for embedded and control-oriented systems.
The key difference between the two is their size and connector configuration. The REN module has two board-to-board (B2B) connectors, while the REN+ module includes three B2B connectors to support more IO and better system expansion. Despite these differences, both SOMs are compatible with the same carrier card, giving designers seamless scalability and flexibility during product development.
What is OREN/OREN+?
OREN and OREN+ form factors are mid-range FPGA system on modules designed for balanced performance and scalability. Two board-to-board connectors with limited transceivers in OREN, while OREN+ provides higher transceiver capacity with additional connectors. Both compatible with the same carrier card for flexible system integration.
What is BRYN/BRYN+?
BRYN and BRYN+ form factors are intended for high-performance FPGA system on modules that provide superior data throughput and advanced connectivity. These form factors provide more transceivers along with relatively fewer FPGA I/Os and require higher power input to enable advanced performance specifications. The main difference is their size and connector arrangement — BRYN has space for three board-to-board connectors, while BRYN+ provides three or more, providing enhanced scalability and system flexibility.
| REN | REN+ | OREN | OREN+ | BRYNc | BRYN | BRYN+ | |
|---|---|---|---|---|---|---|---|
| Size (L x W) | 60mm x 50mm | 80mm x 70mm | 75mm x 95mm | 75mm x 110mm | 100mm x 82mm | 100mm x 90mm | – |
| Power Input | 5V | 5V | 5V | 5V | 12V | 12V | 12V |
| No. of B2B | 2 + 1 | 2 + 1 | 2 | 4 | 3 + 1 | 3 + 1 | 3 + 1 |
| Total No. of FPGA IO Banks Supported | 3 Dedicated Banks, 2 Optional from B2B3 and B2B2¹ | 3 | 4 | 4 | 3 | 3 | 3 |
| Total No. of High-Speed Transceivers Supported | 4 Dedicated and 8 from B2B3² | 12 + 8 (Optional) | 16 | 48 | 80 + 52 | 80 + 52 | 80 + 52 |
| Total No. Low-Speed Transceivers Supported | 4³ | 4 | 4 | 4 | 4 | 4 | 4 |
| Total No. Low-Speed Transceivers Supported | 4³ | 4 | 4 | 4 | 4 | 4 | 4 |
| Total No. of FPGA IOs (DIFF/Single Ended) | 81DIFF/162SE and 51DIFF/102SE from B2B2 and B2B34 | 162 + 54 + 54 | 142 | 142 | 192 + 88 + 8 + 48 | 192 + 88 + 8 + 48 | 192 + 88 + 8 + 48 |
| Total No. of MSIO | 7 | 26 | 19 | 19 | 19 | ||
| Total No. of B2B Control Signals | 12 | 12 | 24 | 24 | 24 | ||
| Total No. of Processor Interface Specific Pins | 60 | TBD | 64 | 64 | 64 | ||
| Optional Analog Pins support? | Yes | Optional | No | No | Yes | Yes | yes |
| Total No. of ADC Pins supported in B2B3 | 10 | TBD | 16 | 16 | 16 | ||
| Total No. of DAC Pins supported in B2B3 | 8 | TBD | 16 | 16 | 16 |
iWave FPGA Product Portfolio: Form Factor Breakdown
iWave offers a comprehensive range of FPGA system on modules (SOMs) designed to meet the diverse requirements of embedded and high-performance systems. To simplify the selection process, our product portfolio is organized by form factor, providing scalable solutions that range from compact modules to high-performance accelerators. Each form factor is designed to balance I/O capabilities, memory options, power consumption, and connector configurations, ensuring seamless integration with carrier boards and allowing flexibility for future performance upgrades. This structured approach enables system designers to choose the right module for their current requirements while retaining the ability to scale and adapt as system demands evolve.
BRYN/BRYNc
Zynq ™ UltraScale+™ RFSoC
Versal ™ adaptive SoC
Virtex ™ UltraScale+ FPGA
Kintex ™ UltraScale+ FPGA
OREN / OREN+
Zynq ™ UltraScale+ MPSoC
Virtex UltraScale+ FPGA
Kintex UltraScale+™ FPGA
- KU19P / KU095 / KU115
- KU3P / KU5P
REN/REN+
Zynq UltraScale+™ MPSoC
Versal ™ AI Edge/Prime
Artix™ UltraScale+™ FPGA
Spartan™ UltraScale+™ FPGA
iWave’s FPGA System-on-Modules (SOMs) provide a scalable and future-ready foundation for building advanced embedded and high-performance systems. With form factors ranging from REN and OREN to BYRN and their enhanced versions, these modules enable seamless scalability, consistent design integration, and reduced development complexity. This unified approach allows designers to adapt to evolving performance needs without major hardware redesigns, ensuring flexibility, faster time-to-market, and long-term reliability across diverse applications.
With over 26 years of diverse experience in the FPGA domain and a strong design-to-deployment competence, iWave strives to transform your ideas into time-to-market products with reliability, cost, and performance balance. Looking for more insights? Contact us at mktg@iwave-global.com to explore more Visit www.iwave-global.com
