i.MX 95 Size-L based OSM System on Module
iG-G61M®
- i.MX 95 CPU with 6 Arm Cortex-A55 @2.0 GHz, 1 x Cortex-M33 @333MHz, 1 x Cortex-M7 @800MHz
- 8GB LPDDR5
- 16GB eMMC
- Supports 2 x 1Gb Ethernet
- OSM v1.2 Size-LF LGA Solderable Module
Documents
Documents
Design Support
| Features | Details |
|---|---|
| CPU | i.MX 95: 6 Arm Cortex-A55 @2.0 GHz, 1 x Cortex-M33 @333MHz, 1 x Cortex-M7 @800MHz |
| Memory & Storage | 8GB LPDDR5 16GB eMMC 32Kb EPPROM |
| OSM LGA Features | 2 x RGMII 1 x USB 2.0 1 x USB 3.0 2 x SD (4bit) 2 x SPI 3 x I2C 2 x UART with Flow Control 2 x I2S 1 x UART w/o Flow Control 1 x Debug UART 2 x CAN 2 x PCIe 3.0 2 x LVDS (4 lane) 1 x MIPI CSI (4 lane) 1 x MIPI DSI/CSI (4 lane) 2 x PWM 1 x JTAG 1 x XFI/USXGMII(10G Ethernet) 6 x ADC(ADC x 4 supported through vendor defined pins) GPIOs |
| OS Support | Android Auto 15 |
| General Features | Power Input: 5V, 2.5A through OSM LGA Form Factor: 45mm x 45mm Operating Temperature: -40°C to +105°C (Automotive Grade) Environmental Specification: REACH & RoHS3 Compliant |
- 1000/100/10 Mbps Ethernet Jack x 2
- USB 2.0 OTG (microAB Receptacle Connector) x 1
- USB 3.0 x1 (Dual-stack Type-A Connector)/USB Type-C connector
- Micro SD Connector
- Debug UART Header x 1
- 4 Lane MIPI DSI Display Connector
- 4 Lane LVDS Display Connector
- MIPI CSI Camera Connector
- RS232 Header x 1
- M.2 Key-B Connector x 1
- 3.5mm Audio In & Out Jack through I2S Codec x 1
- LINE IN & OUT Speaker Headers
- CAN Header x 1
- SPI flash
Thermal design For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink solution i.MX95 OSM LGA Module
Enclosure is essential for a SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.
