i.MX 91 OSM-LF LGA
System on Module
iG-G50M®
- i.MX 91 CPU with 1 x Arm Cortex-A55 cores @1.4GHz
- Up to 2GB LPDDR4 Memory
- 16GB eMMC Flash Expandable up to 128GB
- Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 Connectivity
- Supports 2 × 1Gbps Ethernet (1 with TSN)
- OSM v1.1 Size-L LGA Solderable Module
Documents
| Features | Details |
|---|---|
| CPU | 1 x Cortex-A55@1.4 GHz |
| Memory & Storage | LPDDR4 – 2GB eMMC Flash – 16GB (Expandable) |
| Other | Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 1:4 USB2.0 HUB External RTC Controller Programming Header |
| OSM LGA Features | RGMII x 2 SD(4bit) x 1 USB 2.0 OTG x 1 USB 2.0 HOST x 4 CAN x 2 UART x 3 (1 is optional) Debug UART x 1 I2S x 1 SPI x 1 I2C x 2 PWM x 1 JTAG x 1 GPIOs |
| OS Support | Linux 6.1.22 |
| General Features | Power Input: 5V, 2.5A through OSM BGA Form Factor: 45mm x 45mm (Size L) Operating Temperature: -40°C to +85°C (Industrial) Environment Specification: REACH & RoHS3 Compliant |
- Dual 1000/100/10 Mbps Ethernet
- CAN Header x 1
- USB 2.0 OTG (micro–AB Receptacle Connector) x 1
- Dual USB 2.0 Host (Type A) x 1
- Micro SD
- Debug UART Header x 1
- 3.5mm Audio In & Out Jack through I2S Codec x 1
- GNSS receiver Module – GPS/GLONASS/Galileo/BeiDou
- M.2 Connector Key B/M (Key M is optional)
- USB Touch Header x 1
- LINE IN & OUT Speaker Headers
- RS232 Header x 1
Thermal design is a critical aspect for any highly integrated OSM module. iWave offers Heat Sink and Heat Spreader solution for i.MX91 OSM LGA Module
Enclosure is important for any SBC, and iWave offers rugged aluminum and metal options that protect the device while ensuring full access to all major ports.
