January 28, 2026
Article
High-speed chip-to-chip communication is a critical requirement in modern data-intensive systems such as 5G infrastructure, AI-driven networking platforms, and high-frequency trading environments. 150G Interlaken is a widely adopted for high-speed serial interface protocol designed to meet these requirements by enabling low-latency, scalable data transfer between devices. As an open-standard serial interface, 150G Interlaken supports flexible lane configurations along with strong error-handling mechanisms, making it well suited for high-bandwidth applications.
iWave’s Zynq™ UltraScale+™ MPSoC platforms, powered by AMD support soft 150G Interlaken implementations, enabling throughput of up to 150 Gbps per block using 6 lanes operating at 25.78125 Gbps. This capability allows designers to implement efficient, high-performance interconnects for next-generation networking and compute platforms.
The 150G Interlaken IP core is offered under the AMD Project License. Once the Project License Agreement is executed, the IP core functionality is enabled based on the selected device part number. The core interfaces with Gigabit Transceivers (GTs) for high-speed serial I/O and provides a flexible protocol layer that reduces pin count and power consumption. Its burst-oriented transfer mechanism makes it especially suitable for packet-based processing and network acceleration use cases.
The Interlaken 150G IP core is delivered as a soft macro, allowing straightforward implementation on supported AMD devices. It is commonly used as a chip-to-chip interconnect between multiple system components, taking advantage of Interlaken’s ability to operate across a range of lane widths and line rates to match specific bandwidth requirements.
The lane-logic-only mode enables each serial transceiver to participate in forming a complete Interlaken interface. To deploy the core, it must be connected to the high-speed serial transceiver blocks, supplied with the required clock sources, and interfaced to the Local Bus (LBUS) on the user side. This architecture simplifies integration while maintaining high performance and scalability.
The following sequence outlines the operation after the 150G Interlaken IP core is powered up:
Conclusion
The validation of 150G Interlaken on the Zynq™ UltraScale+™ ZU19EG MPSoC platform demonstrates a robust and high-performance solution for next-generation chip-to-chip interconnects. By integrating iWave’s ZU19EG Zynq UltraScale+ SoM with AMD technology, this platform enables efficient data acquisition and processing, making it well suited for demanding high-speed communication and networking applications.
For more information or inquiries, reach out to mktg@iwave-global.com
We appreciate you contacting iWave.
Our representative will get in touch with you soon!