In the realm of embedded computing, standards like SMARC and Qseven have long served as the foundation for System-on-Modules (SoMs). However, the SGeT (Standardization Group for Embedded Technologies) has introduced a game-changing specification, the Open Standard Module (OSM). This standard redefines modular computing by enabling compact, solderable, and scalable SoMs across a broad range of applications.
What Is the OSM Standard?
OSM, launched as the OSM 1.0 specification in December 2020, is one of the first industry standards designed for directly solderable modules. Unlike traditional SoMs that use board-to-board connectors, OSM modules feature a Land Grid Array (LGA) package that allows permanent soldering to a carrier board. This design brings greater robustness, especially in vibration-prone environments, and reduces the overall form factor.
Key Characteristics of OSM
The OSM standard offers several distinctive features:
- Machine-Processable Design: OSM modules are made for efficient soldering, assembly, and automated testing.
- LGA Package for Soldering: Modules come with a pre-tinned LGA interface, eliminating the need for bulky connectors.
- Defined Interfaces: Soft (software) and hard (hardware) signal interfaces are standardized, enabling better compatibility.
- Open Specifications: Both hardware and software aspects of OSM are open, supporting collaborative development.
OSM Form Factors (Sizes)
The OSM standard supports four sizes: Size-0, Small, Medium, and Large, each offering different I/O capabilities and LGA contact densities.
- Size-0: Ultra-compact, with minimal I/O but high-density LGA contacts.
- Size-S and up: Support for video (RGB, DSI), medium form factors can add eDP, and Size-L modules offer LVDS and up to 10 PCIe lanes.
- In addition, there’s a dedicated communication pin-area for wireless connectivity: 18 pins for antenna signals and 19 for vendor-specific signals.
Why Choose OSM?
OSM brings several compelling advantages:
- Ruggedness: Soldered LGA modules are more resistant to vibration.
- Miniaturization: Smaller form factors with a very high pin-to-area ratio.
- Scalability: Easily upgradeable by switching modules for future generations.
- Cost Efficiency: Reduced BOM (bill of materials) cost by eliminating connectors and simplifying board design.
- Open Ecosystem: Shared specifications make it easier for module vendors and system designers to innovate.
Applications of OSM Modules
Because of their robustness and compact size, OSM modules are ideal for a wide range of use cases:
- Edge / industrial IoT devices in harsh environments
- Embedded systems where space is at a premium, such as portable or wearable devices
- Products needing long life cycles and upgradable compute power via modular design
iWave’s OSM System on Module Portfolio
iWave’s OSM portfolio offers a broad range of solderable, rugged System on Modules that follow the Open Standard Module (OSM) specification enabling high reliability and modularity for modern embedded applications.
- Our flagship i.MX 8M Plus remains a standout, but it’s just one part of a growing family that addresses diverse use cases from industrial automation to edge AI.
- We’ve expanded into automotive and V2X domains with the i.MX 8XLite platform, which offers compact (30 × 30 mm) solderable OSM design.
- For ultra-compact, power-efficient designs, our STM32MP13x MPU within the smallest OSM Size-0 form factor (30 × 15 mm).
- Our TI AM62Lx & AM62Ax delivers a low-power, industrial-grade option on a solderable OSM v1.2 Size-SF footprint.
- And for high-efficiency edge compute with modern connectivity, i.MX 9 series supports LGA soldering, making it ideal for compact applications with robust performance.
These modules leverage iWave’s deep expertise in embedded hardware and software, offering customers form-factor scalability, long-term availability, and flexibility to scale performance across generations.
Conclusion
The OSM standard is redefining how modular embedded computing is done — delivering a rugged, compact, and scalable solution for modern SoMs. By leveraging solderable LGA modules, OSM offers a resilient and flexible foundation for edge systems, industrial devices, and IoT products. With iWave’s OSM-compliant modules, companies can adopt future-ready architectures while controlling cost and reducing complexity.
To learn more about iWave’s expertise in OSM, reach out to our team at mktg@iwave-global.com
