iWave Global, a provider of embedded edge computing and System on Module (SoM) solution, has introduced a compact
iG-G55M® TI AM62D based Open Standard Module (OSM) designed to deliver high-performance processing, connectivity, and flexible expansion for demanding embedded applications.
Built around the TI AM62D processor, combines multi-core Arm processing, high-speed memory, integrated storage, and a wide range of interfaces in a compact, solderable OSM form factor. The module is designed to help system developers accelerate product development while reducing overall system size and design complexity
High-Performance Processing & DSP in a Compact OSM:
The iG-G55M® TI AM62D-based OSM integrates four Arm Cortex-A53 cores operating at up to 1.4GHz for application processing and two Arm Cortex-R5F cores operating at up to 800MHz for real-time processing and device-management functions.
For DSP-intensive workloads, the module features a C7xV DSP with a Matrix Multiplication Accelerator, delivering up to 40 GFLOPS of DSP performance. This processing capability is well suited for applications involving audio processing, signal processing, machine learning acceleration, and other compute-intensive embedded workloads.
The module comes with 2GB LPDDR4 memory, expandable up to 8GB, along with 16GB eMMC storage and 16Mb QSPI Flash, providing the memory and storage resources required for demanding embedded applications
Compact OSM Size L with Extensive Connectivity
Built on the Open Standard Module (OSM) Size L form factor, just 45 mm × 45 mm, enabling developers to integrate powerful computing into space-constrained products.
The module provides a broad range of interfaces, including 2 × Gigabit Ethernet, 2 × USB 2.0, MIPI CSI, 2 × CAN, 4 × UART, 3 × I²C, 2 × PWM, I²S, SD, JTAG, Debug UART, and GPIOs.
Its OSM LGA interface also provides a 5V power input, while the standardized solderable form factor enables robust integration into customized carrier boards.
Key Highlights
- TI AM62D-based OSM L
- C7xV DSP with Matrix Multiplication Accelerator
- 4 × Arm Cortex-A53 @ 1.4GHz
- 2 × Arm Cortex-R5F @ 800MHz
- 2GB LPDDR4, expandable up to 8GB
- 16GB eMMC and 16Mb QSPI Flash
- 2 × Gigabit Ethernet
- USB, CAN, UART, I²C, I²S, MIPI CSI and SD interfaces
- 45mm × 45mm compact OSM L form factor
- -40°C to +85°C operating temperature
- Linux support
- OSM-based SBC available for development and evaluation
Designed for Demanding Applications
The iG-G55M® TI AM62D-based OSM is designed to support a wide range of demanding embedded applications, including:
- Audio Processing Smart Amplifiers
- Automotive Audio
- Infotainment
- Medical & Healthcare
- Aerospace & Defense
- Radar
Ready to Start Your Embedded Design?
Explore the iG-G55M® TI AM62D-based OSM and discover how it can support your next embedded product design.
iWave Global provides System on Module (SoM) and Development Kit solutions along with comprehensive ODM engineering services, helping customers move efficiently from evaluation to production. With over 27 years of embedded technology expertise, iWave supports application specific customization, including carrier card design, system design, thermal simulation, and software customization, across industries such as industrial, medical, automotive, IoT, and computer vision. With a commitment to 10+ years of SoM availability, iWave helps customers build long-lifecycle products with confidence, backed by technical guidance and end-to-end product development support. For more information, visit the iWave Global website or contact mktg@iwave-global.com
