i.MX 93 OSM Size-S System on Module
iG-G50M®
- i.MX 93 CPU with Dual Arm Cortex-A55 & Arm Cortex-M33
- 1GB LPDDR4X Memory
- 8GB eMMC Flash Memory
- NPU with up to 0.5 TOPS Neural Network performance
- Supports 1Gbps Ethernet x 2
Documents
| Features | Details |
|---|---|
| CPU | i.MX 9352: 2 x Cortex-A55, NPU i.MX 9351: 1 x Cortex-A55, NPU i.MX 9332: 2 x Cortex-A55 i.MX 9331: 1 x Cortex-A55 |
| Memory & Storage | 1GB LPDDR4X, expandable up to 2GB 8GB eMMC, expandable up to 32GB 32Kb EPPROM |
| OSM LGA Features | RGMII x 2 USB 2.0 OTG x 2 SD (4bit) x 1 SPI x 1 I2C x 2 UART with Flow Control x 1 UART w/o Flow Control x 1 Debug UART x 1 CAN x 2 RGB (18bit) x 1 2 lane MIPI CSI x 1 4 lane MIPI DSI x 1 PWM x 1 ADC x 2 GPIOs x 8 |
| OS Support | Linux 6.6.52 Debian OS FreeRTOS |
| General Features | Power Input: 5V Form Factor: 30mm x 30mm (Size S) Operating Temperature: -40°C to +85°C (Industrial) Environment Specification: REACH & RoHS3 Compliant |
- 1000/100/10 Mbps Ethernet Jack
- USB 2.0 OTG (microAB Receptacle Connector) x 1/ USB 3.0 x1 (Dual-stack Type-A Connector)
- USB2.0 Header x 1
- Micro SD Connector x 1
- Debug UART Header x 1
- RS232 Header x 1
- RS485 Header x 1
- CAN Header x 1
- RGB (18bit) x 1
- 4 Lane MIPI DSI Display Connector
- MIPI CSI Camera Connector
- SPI flash
For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink solution for i.MX 93 OSM LGA Module.
