Zynq™ UltraScale+™ ZU5/ZU4/ZU3/ZU2 MPSoC Single Board Computer

iG-G36S®

  • Compatible with ZU5/4/3/2 CG/EG/EV devices
  • Up to 256K Logic Cells
  • 2GB DDR4 with ECC for PS (Expandable), 1GB DDR4 for PL, 8GB eMMC Flash (Expandable)
  • Wi-Fi 5 & Bluetooth 5.0 Wireless Connectivity
  • 2 x Gigabit Ethernet, 2 x USB 3.0
  • One 10G Ethernet & Dual 1G Ethernet
CONTACT SALES
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Documents

Features Details
ZU5/ZU4/ZU3/ZU2 – Zynq Ultrascale+ MPSoC Processing System (PS)

  • Quad/Dual ARM Cortex-A53 @ 1.5GHz, Dual
  • Cortex-R5 @ 600MHz
  • 264/H.265 Video Encoder/Decoder (VCU)
  • ARM Mali-400MP2 GPU @ 677MHz

Programming Logic (PL)

  • Up to 256K Logic cells
RAM Memory 64bit, 2GB DDR4 with ECC for PS (Upgradable up to 8GB)
32bit, 1GB DDR4 for PL (Upgradable up to 4GB)
8GB eMMC Flash (Upgradable)
Micro SD Connector#
EEPROM for MAC Address
Memory Interfaces 256MB QSPI Flash for boot & storage (Optional)
16GB eMMC Flash for boot & storage (Expandable up to 128GB)
EEPROM (4Kbit)
Features from PS WLAN 802.11a/b/g/n/ac & BT 5.0 Combo Module with Antenna connector
Dual 10/100/1000Mbps Ethernet through RJ45 Magjack
Dual USB3.0 Type A Jack
DP 1.2a Display Port Connector
2 Key B Connector with SATA 3.1& USB3.0
Debug UART Header
JTAG Header
RTC Coin cell Header
Features from PL GTH Transceivers* 4K HDMI 2.0 Output Connector
4K HDMI 2.0 Input Connector
10G Ethernet through SFP+ Connector
12G SDI Input through BNC Jack#
12G SDI Output through BNC Jack#
Board to Board Connectors PS Interfaces

  • SPI x 1
  • CAN x 2
  • I2C x 1
  • UART x 1

PL Interfaces

  • FPGA IOs from HP Bank – 20LVDS/40SE
  • FPGA IOs from HD Bank – 41LVDS/82SE
OS Support Linux BSP – Petalinux 2022.2
Baremetal BSP – Vivado 2020.1
General Features
  • Power Input: 12V through Power Jack
  • Operating Temperature: -40°C to +85°C
  • Form Factor: 100mm x 72mm
  • BSP Support: Linux 5.4/Vivado2021.1
  • Environment Specification: RoHS & REACH Compliant
  • Compliance: CE*

Notes:#Optional
*PL GTH Transceivers are not supported in ZU3 & ZU2 MPSoC
*Under Progress
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iWave offers rugged, aesthetically designed aluminum and metal sheet enclosures for the SBC, serving a dual purpose as both a heatsink and protective casing, while ensuring full access to all major ports.

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FAQs

An MPSoC SoM provides a proven and reliable design with optimized signal integrity, DDR tuning, and power sequencing. It reduces development cost and risk while helping accelerate time to market.

Yes. MPSoC SOMs are designed to scale across different performance levels, allowing developers to choose devices within the Zynq UltraScale+ MPSoC family (from ZU1 to ZU19) based on their application needs. This makes it easier to upgrade or adapt designs without major hardware changes.
For long-term use, SoMs from iWave are supported throughout their lifecycle, ensuring availability, reliability, and ongoing support. This helps avoid supply chain issues and keeps production stable.

  • Heterogeneous Compute in One Chip
  • Real-Time High Performance on the Same Platform
  • High-Speed Connectivity & Deterministic I/O
  • Lower System Cost & Power Consumption
  • Flexibility & Future-Proofing Through Programmable Logic
  • Scalable for Multiple Use Cases

Yes. With scalable MIPI CSI-2 support, MPSoC SOMs can handle multiple cameras, making them suitable for vision and imaging systems.

MPSoC SOMs support a wide range of high-speed interfaces, including:

  • PCIe, USB, and Ethernet
  • QSPI, eMMC, SRAM, and EEPROM
  • LVDS for high-speed data transfer
  • MIPI CSI-2 for camera and vision applications
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